AGLN250V2-CSG81I

IC FPGA 60 I/O 81CSP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 60 36864 6144 81-WFBGA, CSBGA

Quantity 831 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package81-CSP (5x5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case81-WFBGA, CSBGANumber of I/O60Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN250V2-CSG81I – IGLOO nano FPGA, 60 I/Os, 6,144 logic elements

The AGLN250V2-CSG81I is an IGLOO nano Field Programmable Gate Array (FPGA) IC designed for industrial applications that require reconfigurable digital logic. It combines 6,144 logic elements with 36,864 bits of on-chip RAM and supports 60 I/O pins, providing a balanced resource set for embedded logic, control, and interface tasks.

Packaged in an 81-WFBGA (CSBGA) / 81-CSP (5×5) supplier package and rated for an operating range from -40 °C to 100 °C, this device is specified for surface-mount assembly and RoHS-compliant production environments.

Key Features

  • Core Logic  6,144 logic elements (cells) providing programmable logic capacity suitable for mid-range FPGA designs.
  • Embedded Memory  36,864 bits of on-chip RAM to support buffers, FIFOs, and small on-chip data structures.
  • I/O and Gate Count  60 general-purpose I/O pins and a device gate equivalence of 250,000 gates to support a variety of peripheral and interface needs.
  • Power Supply  Nominal supply range from 1.14 V to 1.575 V, enabling integration into low-voltage system power rails.
  • Package and Mounting  81-WFBGA (CSBGA) package with supplier device package 81-CSP (5×5); designed for surface-mount assembly.
  • Industrial Temperature Grade  Specified operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance  RoHS-compliant for conformity with lead-free manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control  Use the device's 6,144 logic elements and 60 I/Os for implementing control logic, timing and interface glue in factory automation and PLC modules.
  • Embedded Systems  Integrate configurable logic and on-chip RAM to support custom processing, protocol handling, and peripheral interfacing in embedded products.
  • Sensing and Data Acquisition  Leverage the device I/O count and on-chip memory for sensor aggregation, signal conditioning interfaces, and temporary data buffering.

Unique Advantages

  • Balanced Logic and Memory:  6,144 logic elements paired with 36,864 bits of RAM deliver a practical mix of programmable logic and embedded memory for common mid-range designs.
  • Compact, Surface-Mount Package:  The 81-WFBGA/81-CSP (5×5) footprint supports space-constrained boards while maintaining access to 60 I/Os.
  • Low-Voltage Operation:  Operates from 1.14 V to 1.575 V to match modern low-voltage system rails and help simplify power-supply design.
  • Industrial Temperature Rating:  Specified for -40 °C to 100 °C operation to address industrial deployments that require extended temperature ranges.
  • Regulatory Compliance:  RoHS compliance supports lead-free manufacturing and regulatory requirements for global production.

Why Choose AGLN250V2-CSG81I?

The AGLN250V2-CSG81I positions itself as a practical, industrial-grade FPGA option for designs that need a moderate amount of programmable logic, on-chip memory, and a reasonable I/O complement in a compact surface-mount package. Its specification for low-voltage supply rails and extended operating temperature makes it suitable for embedded and industrial applications where board space, power, and environmental resilience are key considerations.

This device is appropriate for engineers and teams building mid-range reconfigurable systems who require straightforward logic capacity, integrated RAM, and compliance with RoHS manufacturing practices. The combination of package density, I/O availability, and thermal range supports scalable designs and long-term production deployments.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for AGLN250V2-CSG81I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up