AGLN250V2-CSG81I
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 60 36864 6144 81-WFBGA, CSBGA |
|---|---|
| Quantity | 831 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 81-CSP (5x5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 81-WFBGA, CSBGA | Number of I/O | 60 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGLN250V2-CSG81I – IGLOO nano FPGA, 60 I/Os, 6,144 logic elements
The AGLN250V2-CSG81I is an IGLOO nano Field Programmable Gate Array (FPGA) IC designed for industrial applications that require reconfigurable digital logic. It combines 6,144 logic elements with 36,864 bits of on-chip RAM and supports 60 I/O pins, providing a balanced resource set for embedded logic, control, and interface tasks.
Packaged in an 81-WFBGA (CSBGA) / 81-CSP (5×5) supplier package and rated for an operating range from -40 °C to 100 °C, this device is specified for surface-mount assembly and RoHS-compliant production environments.
Key Features
- Core Logic 6,144 logic elements (cells) providing programmable logic capacity suitable for mid-range FPGA designs.
- Embedded Memory 36,864 bits of on-chip RAM to support buffers, FIFOs, and small on-chip data structures.
- I/O and Gate Count 60 general-purpose I/O pins and a device gate equivalence of 250,000 gates to support a variety of peripheral and interface needs.
- Power Supply Nominal supply range from 1.14 V to 1.575 V, enabling integration into low-voltage system power rails.
- Package and Mounting 81-WFBGA (CSBGA) package with supplier device package 81-CSP (5×5); designed for surface-mount assembly.
- Industrial Temperature Grade Specified operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
- Environmental Compliance RoHS-compliant for conformity with lead-free manufacturing and regulatory requirements.
Typical Applications
- Industrial Control Use the device's 6,144 logic elements and 60 I/Os for implementing control logic, timing and interface glue in factory automation and PLC modules.
- Embedded Systems Integrate configurable logic and on-chip RAM to support custom processing, protocol handling, and peripheral interfacing in embedded products.
- Sensing and Data Acquisition Leverage the device I/O count and on-chip memory for sensor aggregation, signal conditioning interfaces, and temporary data buffering.
Unique Advantages
- Balanced Logic and Memory: 6,144 logic elements paired with 36,864 bits of RAM deliver a practical mix of programmable logic and embedded memory for common mid-range designs.
- Compact, Surface-Mount Package: The 81-WFBGA/81-CSP (5×5) footprint supports space-constrained boards while maintaining access to 60 I/Os.
- Low-Voltage Operation: Operates from 1.14 V to 1.575 V to match modern low-voltage system rails and help simplify power-supply design.
- Industrial Temperature Rating: Specified for -40 °C to 100 °C operation to address industrial deployments that require extended temperature ranges.
- Regulatory Compliance: RoHS compliance supports lead-free manufacturing and regulatory requirements for global production.
Why Choose AGLN250V2-CSG81I?
The AGLN250V2-CSG81I positions itself as a practical, industrial-grade FPGA option for designs that need a moderate amount of programmable logic, on-chip memory, and a reasonable I/O complement in a compact surface-mount package. Its specification for low-voltage supply rails and extended operating temperature makes it suitable for embedded and industrial applications where board space, power, and environmental resilience are key considerations.
This device is appropriate for engineers and teams building mid-range reconfigurable systems who require straightforward logic capacity, integrated RAM, and compliance with RoHS manufacturing practices. The combination of package density, I/O availability, and thermal range supports scalable designs and long-term production deployments.
Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for AGLN250V2-CSG81I.

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