AGLN250V2-CSG81

IC FPGA 60 I/O 81CSP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 60 36864 6144 81-WFBGA, CSBGA

Quantity 373 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package81-CSP (5x5)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case81-WFBGA, CSBGANumber of I/O60Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN250V2-CSG81 – IGLOO nano Field Programmable Gate Array (FPGA) IC 60 I/O 36,864-bit RAM 6,144 logic elements 81-WFBGA, CSBGA

The AGLN250V2-CSG81 is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 6,144 logic elements and approximately 36,864 bits of on-chip RAM in a compact 81-WFBGA CSBGA package.

With 60 user I/O, an estimated 250,000 gates of logic capacity, and a supply voltage range of 1.14 V to 1.575 V, this commercial-grade, surface-mount FPGA is designed for compact designs that require programmable logic and embedded memory within a standard commercial temperature range.

Key Features

  • Core Logic 6,144 logic elements (cells) providing a mid-density programmable fabric for custom logic and control functions.
  • Embedded Memory Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
  • I/O Resources 60 user I/O pins to support a range of peripheral and interface connections on a single FPGA device.
  • Gate Capacity Approximately 250,000 gates of logic capacity for implementing combinational and sequential designs.
  • Power Operates from a supply voltage range of 1.14 V to 1.575 V to match system power rails and design constraints.
  • Package and Mounting 81-WFBGA, CSBGA package (supplier device package: 81-CSP 5×5) in a surface-mount form factor for compact PCB integration.
  • Temperature Grade Commercial operating temperature range of −20°C to 85°C for standard commercial applications.
  • Compliance RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

  • Consumer and Embedded Electronics Compact programmable logic and I/O interfacing where 6,144 logic elements and 60 I/Os enable integration of custom peripherals and glue logic.
  • Control and Signal Processing Small-scale control, pre-processing, and protocol handling using on-chip RAM and the device’s gate capacity for custom state machines and buffering.
  • Prototyping and Custom Logic Development and validation of custom logic functions in a commercial-temperature FPGA package suitable for board-level evaluation and integration.

Unique Advantages

  • Mid-density programmable fabric: 6,144 logic elements provide a balance of capacity and package size for many custom logic tasks without overprovisioning.
  • Integrated embedded memory: 36,864 bits of on-chip RAM reduce external memory requirements for small buffers and lookup tables.
  • Compact CSP/WFBGA packaging: 81-WFBGA (81-CSP 5×5) surface-mount package saves PCB area and supports high-density board layouts.
  • Flexible I/O count: 60 user I/Os enable multiple peripheral connections and interface combinations on a single device.
  • Commercial temperature and RoHS compliance: Suitable for standard commercial deployments with lead-free manufacturing compliance.
  • Defined supply range: 1.14 V to 1.575 V operation to match modern supply architectures in compact systems.

Why Choose AGLN250V2-CSG81?

The AGLN250V2-CSG81 delivers a compact, mid-density FPGA option for designers who need a programmable solution with 6,144 logic elements, on-chip RAM, and 60 I/Os in a small 81-WFBGA CSBGA package. Its defined supply voltage range and commercial operating temperature make it suitable for a wide range of standard embedded and consumer-focused designs.

Manufactured by Microchip Technology and RoHS compliant, this device is a practical choice for projects that require integrated logic and memory in a surface-mount form factor while maintaining a clear set of electrical and thermal operating parameters.

Request a quote or submit a sourcing inquiry to learn about availability and lead times for the AGLN250V2-CSG81.

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