AGLN250V5-CSG81I

IC FPGA 60 I/O 81CSP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 60 36864 6144 81-WFBGA, CSBGA

Quantity 419 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package81-CSP (5x5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case81-WFBGA, CSBGANumber of I/O60Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN250V5-CSG81I – IGLOO nano Field Programmable Gate Array (FPGA), 6,144 Logic Elements

The AGLN250V5-CSG81I is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for embedded and industrial applications. It provides a mid-range programmable fabric with 6,144 logic elements, approximately 36.9 kbits of on-chip RAM, and roughly 250,000 gates to implement custom logic, glue logic, and peripheral interfacing.

Packaged in a compact 81‑WFBGA (CSBGA) footprint with a 5×5 supplier device package option, this industrial‑grade device targets space‑constrained boards that require a reliable, low‑voltage programmable solution with up to 60 general-purpose I/O pins.

Key Features

  • Logic Capacity — 6,144 logic elements (LEs) and approximately 250,000 gates to support moderate complexity designs and custom digital functions.
  • Embedded Memory — Total on‑chip RAM of 36,864 bits, suitable for small buffers, FIFOs, and state-storage in embedded systems.
  • I/O — Up to 60 general-purpose I/O pins for connectivity to sensors, peripherals, and external interfaces.
  • Power and Voltage — Operating supply range of 1.425 V to 1.575 V for integration with low‑voltage system rails.
  • Package and Mounting — 81‑WFBGA (CSBGA) package with supplier device package 81‑CSP (5×5); designed for surface mount assembly.
  • Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
  • Environmental Compliance — RoHS compliant to support regulatory and sustainability requirements.

Typical Applications

  • Industrial Control — Implement custom control logic, state machines, and interface bridging in industrial automation equipment operating across an extended temperature range.
  • Embedded Processing and Glue Logic — Provide mid‑level programmable logic to offload tasks from microcontrollers, implement protocol translators, or consolidate discrete logic components.
  • Sensor and Peripheral Interfacing — Use the 60 I/O pins and on‑chip memory for buffering and managing data between sensors, ADCs/DACs, and host processors.

Unique Advantages

  • Balanced Logic and Memory Density: 6,144 logic elements and 36,864 bits of RAM offer a middle ground for designs that need meaningful programmable resources without a large FPGA footprint.
  • Compact, Surface‑Mount Packaging: 81‑WFBGA/81‑CSP (5×5) packaging enables high functionality in a small PCB area for space‑constrained applications.
  • Industrial Temperature Capability: Rated from -40 °C to 100 °C, supporting deployment in a wide range of industrial environments.
  • Low‑Voltage Operation: Narrow supply window of 1.425 V to 1.575 V for integration with low‑voltage system rails and optimized power domains.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious product designs and regulatory requirements.

Why Choose AGLN250V5-CSG81I?

The AGLN250V5-CSG81I positions itself as a compact, industrial‑grade FPGA option for engineers who need moderate logic density, on‑chip RAM, and a practical I/O count in a small surface‑mount package. Its combination of 6,144 logic elements, approximately 36.9 kbits of embedded memory, and up to 60 I/O makes it suitable for embedded control, interface bridging, and sensor management tasks.

Backed by Microchip Technology and delivered in an 81‑WFBGA/81‑CSP package, this device offers a balance of integration, thermal range, and environmental compliance for long‑lived industrial and embedded projects where board area, reliability, and predictable power rails are key considerations.

Request a quote or submit a purchase inquiry to evaluate the AGLN250V5-CSG81I for your next design. Our team can provide availability and pricing information to support your development and production planning.

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