AGLN250V5-ZVQ100

IC FPGA 68 I/O 100VQFP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 68 36864 6144 100-TQFP

Quantity 1,868 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case100-TQFPNumber of I/O68Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN250V5-ZVQ100 – IGLOO nano FPGA, 250,000 gates, 68 I/Os, ~36 kbits RAM, 100‑TQFP

The AGLN250V5-ZVQ100 is an IGLOO nano low-power flash Field Programmable Gate Array (FPGA) from Microchip Technology. This surface-mount device provides 250,000 system gates realized as 6,144 logic elements, approximately 36 kbits of embedded RAM, and up to 68 user I/Os in a 100‑lead TQFP package.

Designed for power-conscious, reprogrammable system designs, the device supports flash-based nonvolatile configuration, mixed-voltage I/O operation and secure in-system programming—making it suitable for compact, low-power embedded systems and mixed-voltage interfacing tasks within commercial temperature ranges.

Key Features

  • Logic Capacity — 6,144 logic elements (VersaTiles) delivering a 250,000-gate equivalent for implementing glue logic, control and moderate-complexity digital functions.
  • Embedded Memory — Total on-chip RAM of 36,864 bits (approximately 36 kbits) provided in true dual-port SRAM block configurations for FIFOs and buffering.
  • I/O Flexibility — 68 user I/Os with bank-selectable voltages and mixed-voltage support to interface with 1.2 V to 3.3 V domains as required by system peripherals.
  • Low-Power Flash Technology — Flash-based configuration with Flash*Freeze capability for ultra-low power retention of FPGA content and instant-on support (series-level feature).
  • Secure In-System Programming — Supports on-chip AES-based ISP and FlashLock mechanisms for secure configuration and protection of programmed content (series-level capability).
  • Voltage and Temperature — Core supply range of 1.425 V to 1.575 V and an operating temperature range of −20 °C to +85 °C suitable for commercial-grade applications.
  • Package & Mounting — 100‑lead TQFP (supplier package 100‑VQFP, 14×14 mm) in a surface-mount form factor for compact PCB layouts.
  • Compliance — RoHS compliant, aligning with common environmental and manufacturability requirements.

Typical Applications

  • Power-Sensitive Embedded Systems — Low-power flash architecture and Flash*Freeze capability enable use in devices where minimizing standby and active power is important.
  • Mixed-Voltage Interfacing — Bank-selectable I/O voltages allow bridging and interfacing between different logic domains in compact system designs.
  • Secure Reconfigurable Logic — On-chip AES ISP and FlashLock features support secure in-field updates and protected configuration storage for systems requiring controlled reprogramming.
  • Compact Board-Level FPGA Integration — 100‑TQFP packaging and surface-mount mounting make the device suitable for space-constrained PCBs and single-chip solutions.

Unique Advantages

  • High Logic Density in a Small Package: 250,000 gates and 6,144 logic elements provide substantial programmable logic capacity while maintaining a compact 100‑lead TQFP footprint.
  • Nonvolatile, Secure Configuration: Flash-based storage retains design data without battery backup and supports secure in-system programming for update control and intellectual property protection.
  • Flexible I/O and Mixed-Voltage Support: Up to 68 user I/Os with bank-selectable voltages simplify interfacing to a wide range of peripherals and sensors without extra level-shifting components.
  • Engineered for Low Power: Flash*Freeze and low-voltage core operation reduce power consumption during active and retention modes, helping extend battery life in portable designs.
  • Commercial Temperature Grade: Qualified for −20 °C to +85 °C operation to suit a broad set of commercial embedded applications.
  • Manufacturability and Environmental Compliance: Surface-mount 100‑lead TQFP packaging and RoHS compliance support modern assembly processes and regulatory requirements.

Why Choose AGLN250V5-ZVQ100?

The AGLN250V5-ZVQ100 combines a flash-based, low-power FPGA architecture with moderate to high logic capacity and flexible I/O in a compact surface-mount TQFP package. It is positioned for designers needing reprogrammable, secure logic with low standby and active power characteristics, while retaining on-chip RAM for buffering and state storage.

This part is well suited to commercial embedded designs that require secure in-field updates, mixed-voltage interfacing, and a balance of logic density and compact board footprint. Its combination of flash configuration, embedded memory, and I/O flexibility provides a scalable, manufacturable solution for a range of reconfigurable logic tasks.

Request a quote or submit an inquiry to evaluate AGLN250V5-ZVQ100 for your next low-power, reprogrammable design.

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