AGLN250V5-ZVQG100I

IC FPGA 68 I/O 100VQFP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 68 36864 6144 100-TQFP

Quantity 620 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O68Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLN250V5-ZVQG100I – IGLOO nano FPGA — 68 I/O, 6,144 logic elements, 36,864‑bit RAM, 100‑TQFP

The AGLN250V5-ZVQG100I is an IGLOO nano Field Programmable Gate Array (FPGA) IC designed for compact, industrial-grade embedded logic applications. It combines 6,144 logic elements with 36,864 bits of on-chip RAM and 68 I/O pins in a 100‑TQFP surface-mount package, offering a balanced mix of logic capacity, memory and I/O for control and interface designs.

With an industrial operating temperature range of −40 °C to 100 °C and a defined supply voltage range of 1.425 V to 1.575 V, this device is targeted at applications that require reliable operation across a wide temperature span and a compact board footprint.

Key Features

  • Core Logic 6,144 logic elements providing the equivalent of approximately 250,000 gates for implementing custom digital logic and finite-state machines.
  • Embedded Memory 36,864 bits of total on-chip RAM to support buffers, small lookup tables and state storage without external memory.
  • I/O 68 general-purpose I/O pins suitable for interfacing sensors, actuators, peripherals and mid‑density bus connections.
  • Power and Supply Defined voltage supply range of 1.425 V to 1.575 V for predictable power budgeting and rail planning.
  • Package & Mounting 100‑TQFP surface-mount package (supplier package: 100‑VQFP, 14×14 mm) for compact PCB integration and standard assembly processes.
  • Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
  • Regulatory RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

  • Industrial control and automation — Implement custom control logic and peripheral interfacing that benefit from industrial temperature operation and a compact 100‑TQFP footprint.
  • Embedded system interfaces — Use the 68 I/O and on-chip RAM to consolidate glue logic, protocol handling and I/O aggregation in space-constrained designs.
  • Signal bridging and protocol adaptation — Map, buffer and translate signals between subsystems using the available logic elements and RAM without external CPLDs or memory.

Unique Advantages

  • Balanced logic and memory capacity: 6,144 logic elements paired with 36,864 bits of RAM enable mid‑range FPGA implementations without external memory overhead.
  • Compact package: 100‑TQFP (100‑VQFP, 14×14 mm) provides a small PCB footprint while retaining a generous number of I/O pins.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployments in temperature-variable environments.
  • Defined supply window: Narrow 1.425 V–1.575 V supply simplifies power-rail design and margin planning.
  • RoHS compliance: Facilitates lead‑free manufacturing and aligns with common environmental requirements.

Why Choose AGLN250V5-ZVQG100I?

The AGLN250V5-ZVQG100I is positioned for designers who need a mid-density FPGA with on-chip RAM and a robust industrial temperature range packaged in a compact TQFP footprint. Its combination of 6,144 logic elements, 36,864 bits of embedded RAM and 68 I/O pins makes it suitable for systems that require in-system programmable logic, protocol adaptation and interface consolidation without large PCB area or external memory.

For teams building industrial embedded controls, interface modules or compact logic subsystems, this device offers predictable electrical and thermal operating points, RoHS compliance and a package suited for standard surface-mount assembly—supporting design reuse and consistent manufacturing outcomes.

Request a quote or submit a pricing request for the AGLN250V5-ZVQG100I to receive availability, lead-time and ordering information.

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