AGLP060V2-CS201I

IC FPGA 157 I/O 201CSP
Part Description

IGLOO PLUS Field Programmable Gate Array (FPGA) IC 157 18432 1584 201-VFBGA, CSBGA

Quantity 1,326 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package201-CSP (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case201-VFBGA, CSBGANumber of I/O157Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1584Number of Logic Elements/Cells1584
Number of Gates60000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of AGLP060V2-CS201I – IGLOO PLUS FPGA, 1,584 logic elements, 18,432-bit RAM, 157 I/Os, 201-VFBGA

The AGLP060V2-CS201I is an IGLOO PLUS flash-based FPGA IC from Microchip Technology. Based on a 130 nm flash process, this device delivers a low-power, reprogrammable single-chip FPGA solution with 1,584 logic elements, approximately 18,432 bits of embedded RAM, and 157 user I/Os in a 201-VFBGA (CSBGA) package.

Designed for industrial-grade applications, the device targets low-power system functions, secure in-system programming, and mixed-voltage I/O control while operating across a supply range of 1.14 V to 1.575 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

  • Core and Logic — 1,584 logic elements (VersaTiles/D‑flip‑flop resources) and approximately 60,000 system gates for mid-density logic integration.
  • Embedded Memory — 18,432 bits of on-chip RAM (≈18 kbits), with RAM organized in 4,608-bit blocks per the IGLOO PLUS family architecture.
  • I/O and Mixed-Voltage Support — 157 user I/Os with bank-selectable mixed-voltage operation supported by the IGLOO PLUS family architecture for flexible interfacing.
  • Low-Power Operation — Flash*Freeze ultra-low-power mode (AGLP060 typical Flash*Freeze consumption ≈ 10 μW) and low-power active operation for power-sensitive systems.
  • Nonvolatile Flash and Security — Flash-based, reprogrammable configuration with on-chip FlashROM and family-level support for AES-based in-system programming and FlashLock security features.
  • Clocking and PLL — Integrated clock-conditioning circuitry with CCC blocks and an integrated PLL available in the IGLOO PLUS family for configurable clock management.
  • Package and Mounting — 201-VFBGA (CSBGA) package, supplier device package 201-CSP (8×8), and surface-mount mounting suitable for compact board designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Industrial control and automation — Mid-density logic and 157 I/Os enable system glue logic, protocol bridging, and interface control within industrial equipment operating across −40 °C to 100 °C.
  • Low-power embedded systems — Flash*Freeze mode and low-power active capabilities make the device suitable for battery-sensitive or energy-conscious designs that require retained state and rapid recovery.
  • Secure in-system programmable devices — On-chip FlashROM with AES-based in-system programming and FlashLock security support secure firmware distribution and field updates.
  • Mixed-voltage I/O subsystems — Bank-selectable I/O voltages and broad I/O standard support help interface to multiple voltage domains and legacy/peripheral devices.

Unique Advantages

  • Reprogrammable nonvolatile configuration: Flash-based configuration retains the programmed design when powered off, simplifying deployment and updates.
  • Low standby and active power options: Flash*Freeze ultra-low-power mode (~10 μW typical for AGLP060) and low-power active capability reduce system energy consumption.
  • Integrated security and ISP: AES in-system programming and FlashLock support help protect design IP and enable secure field updates.
  • Compact, surface-mount package: 201-VFBGA (CSBGA) packaging and a small 201-CSP (8×8) supplier package option support space-constrained PCB layouts.
  • Industrial temperature rating: −40 °C to 100 °C operation provides robustness for industrial deployments.

Why Choose AGLP060V2-CS201I?

The AGLP060V2-CS201I positions itself as a low-power, mid-density flash FPGA that balances reprogrammability, embedded memory, and a substantial I/O count in a compact surface-mount package. Its family-level features—flash-based nonvolatile configuration, AES ISP security, integrated clock-conditioning, and Flash*Freeze low-power mode—make it suitable for designers requiring retained configuration, secure updates, and power-efficient operation.

This device is a practical choice for engineers developing industrial and embedded systems that need moderate logic capacity, flexible I/O interfacing, and robust operating temperature support while maintaining low standby power and secure in-field programmability.

Request a quote or submit your requirements to receive pricing and availability for the AGLP060V2-CS201I.

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