AGLP060V2-CS201I
| Part Description |
IGLOO PLUS Field Programmable Gate Array (FPGA) IC 157 18432 1584 201-VFBGA, CSBGA |
|---|---|
| Quantity | 1,326 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 201-CSP (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 201-VFBGA, CSBGA | Number of I/O | 157 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1584 | Number of Logic Elements/Cells | 1584 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLP060V2-CS201I – IGLOO PLUS FPGA, 1,584 logic elements, 18,432-bit RAM, 157 I/Os, 201-VFBGA
The AGLP060V2-CS201I is an IGLOO PLUS flash-based FPGA IC from Microchip Technology. Based on a 130 nm flash process, this device delivers a low-power, reprogrammable single-chip FPGA solution with 1,584 logic elements, approximately 18,432 bits of embedded RAM, and 157 user I/Os in a 201-VFBGA (CSBGA) package.
Designed for industrial-grade applications, the device targets low-power system functions, secure in-system programming, and mixed-voltage I/O control while operating across a supply range of 1.14 V to 1.575 V and an ambient temperature range of −40 °C to 100 °C.
Key Features
- Core and Logic — 1,584 logic elements (VersaTiles/D‑flip‑flop resources) and approximately 60,000 system gates for mid-density logic integration.
- Embedded Memory — 18,432 bits of on-chip RAM (≈18 kbits), with RAM organized in 4,608-bit blocks per the IGLOO PLUS family architecture.
- I/O and Mixed-Voltage Support — 157 user I/Os with bank-selectable mixed-voltage operation supported by the IGLOO PLUS family architecture for flexible interfacing.
- Low-Power Operation — Flash*Freeze ultra-low-power mode (AGLP060 typical Flash*Freeze consumption ≈ 10 μW) and low-power active operation for power-sensitive systems.
- Nonvolatile Flash and Security — Flash-based, reprogrammable configuration with on-chip FlashROM and family-level support for AES-based in-system programming and FlashLock security features.
- Clocking and PLL — Integrated clock-conditioning circuitry with CCC blocks and an integrated PLL available in the IGLOO PLUS family for configurable clock management.
- Package and Mounting — 201-VFBGA (CSBGA) package, supplier device package 201-CSP (8×8), and surface-mount mounting suitable for compact board designs.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Industrial control and automation — Mid-density logic and 157 I/Os enable system glue logic, protocol bridging, and interface control within industrial equipment operating across −40 °C to 100 °C.
- Low-power embedded systems — Flash*Freeze mode and low-power active capabilities make the device suitable for battery-sensitive or energy-conscious designs that require retained state and rapid recovery.
- Secure in-system programmable devices — On-chip FlashROM with AES-based in-system programming and FlashLock security support secure firmware distribution and field updates.
- Mixed-voltage I/O subsystems — Bank-selectable I/O voltages and broad I/O standard support help interface to multiple voltage domains and legacy/peripheral devices.
Unique Advantages
- Reprogrammable nonvolatile configuration: Flash-based configuration retains the programmed design when powered off, simplifying deployment and updates.
- Low standby and active power options: Flash*Freeze ultra-low-power mode (~10 μW typical for AGLP060) and low-power active capability reduce system energy consumption.
- Integrated security and ISP: AES in-system programming and FlashLock support help protect design IP and enable secure field updates.
- Compact, surface-mount package: 201-VFBGA (CSBGA) packaging and a small 201-CSP (8×8) supplier package option support space-constrained PCB layouts.
- Industrial temperature rating: −40 °C to 100 °C operation provides robustness for industrial deployments.
Why Choose AGLP060V2-CS201I?
The AGLP060V2-CS201I positions itself as a low-power, mid-density flash FPGA that balances reprogrammability, embedded memory, and a substantial I/O count in a compact surface-mount package. Its family-level features—flash-based nonvolatile configuration, AES ISP security, integrated clock-conditioning, and Flash*Freeze low-power mode—make it suitable for designers requiring retained configuration, secure updates, and power-efficient operation.
This device is a practical choice for engineers developing industrial and embedded systems that need moderate logic capacity, flexible I/O interfacing, and robust operating temperature support while maintaining low standby power and secure in-field programmability.
Request a quote or submit your requirements to receive pricing and availability for the AGLP060V2-CS201I.

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