APA075-TQG100I
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 66 27648 100-LQFP |
|---|---|
| Quantity | 1,345 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 66 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 75000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 27648 |
Overview of APA075-TQG100I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 66 27648 100-LQFP
The APA075-TQG100I is a ProASICPLUS flash-based FPGA from Microchip Technology offering a mid-range logic resource set for embedded and industrial designs. It provides 3,072 logic elements, approximately 27,648 bits of embedded RAM and 66 user I/O pins in a compact 100-LQFP surface-mount package.
Designed for systems that require moderate gate count and on-chip memory at low supply voltages, this device supports 2.3 V to 2.7 V operation and an industrial temperature range of −40 °C to 85 °C, making it suitable for a range of industrial and embedded applications.
Key Features
- Core Logic — 3,072 logic elements (LEs) providing approximately 75,000 gates for mid-density logic implementation and control functions.
- Embedded Memory — 27,648 total RAM bits for state storage, buffering and small data tables directly on-chip.
- I/O — 66 user I/O pins to support multiple peripheral interfaces and signal-level connections.
- Power — Supports a 2.3 V to 2.7 V supply range to match low-voltage system designs and simplify power-rail integration.
- Package & Mounting — Supplied in a 100-LQFP (14 × 14 mm) surface-mount package for compact PCB layouts and standard assembly flows.
- Industrial Temperature & Grade — Rated for −40 °C to 85 °C and specified as Industrial grade for use in temperature-challenging environments.
- Compliance — RoHS compliant construction for environmental and regulatory coverage.
Typical Applications
- Industrial Control — Implement glue logic, I/O aggregation and control functions in industrial embedded systems while taking advantage of the device’s industrial temperature range and 66 I/O pins.
- Embedded System Interfaces — Bridge peripherals and create custom interface logic using the 3,072 logic elements and on-chip RAM for buffering and state machines.
- Module and Board-level Integration — Compact 100-LQFP package and surface-mount mounting enable integration into space-constrained modules and PCBs.
- Protocol Translation and Glue Logic — Use the available logic resources and I/O to implement protocol translators, timing adaptation, and custom glue logic between system components.
Unique Advantages
- Moderate logic density: 3,072 logic elements deliver the capacity needed for mid-range FPGA functions without excessive board-level complexity.
- On-chip RAM for buffering: 27,648 bits of embedded memory support small FIFOs, tables and state retention without external memory.
- Low-voltage operation: 2.3 V to 2.7 V supply range allows straightforward integration with low-voltage digital systems.
- Industrial temperature capability: −40 °C to 85 °C rating supports deployment in demanding environmental conditions.
- Compact surface-mount package: 100-LQFP (14 × 14) format simplifies placement on standard PCBs while preserving I/O accessibility.
- RoHS compliance: Environmentally compliant manufacturing reduces regulatory overhead for assembled products.
Why Choose APA075-TQG100I?
The APA075-TQG100I positions itself as a practical choice for engineers seeking a mid-density, flash-based FPGA with integrated RAM and ample I/O in a standard surface-mount package. Its combination of 3,072 logic elements, on-chip memory and 66 I/O pins provides an efficient platform for interface logic, control tasks and board-level integration in industrial and embedded systems.
Backed by Microchip Technology’s ProASICPLUS family pedigree, this device offers a balance of integration, voltage flexibility and temperature robustness for designs that require reliable operation and compact footprint without external memory complexity.
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