APA1000-BG456

IC FPGA 356 I/O 456BGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA

Quantity 73 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package456-PBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case456-BBGANumber of I/O356Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56320Number of Logic Elements/Cells56320
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits202752

Overview of APA1000-BG456 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA

The APA1000-BG456 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology providing high-density programmable logic in a commercial-grade, surface-mount package. It combines 56,320 logic elements, approximately 0.20 Mbits of embedded memory and 356 I/O to support complex, custom digital designs.

Designed for applications that require significant logic capacity and abundant I/O within a compact 456-ball BGA footprint, the device operates from a 2.3 V to 2.7 V supply and over a 0 °C to 70 °C commercial temperature range.

Key Features

  • Core Logic  56,320 logic elements and 1,000,000 logic gates provide substantial on-chip programmable logic resources for complex designs.
  • Embedded Memory  202,752 total RAM bits, approximately 0.20 Mbits of embedded memory to support buffering, state machines and on-chip data storage.
  • I/O Capacity  356 I/O pins to support wide parallel interfaces, multiple peripherals and extensive board-level connectivity.
  • Power  Single supply voltage range of 2.3 V to 2.7 V to match systems designed around low-voltage domains.
  • Package & Mounting  456-BBGA package (supplier device package: 456-PBGA, 35×35) in a surface-mount form factor for compact board integration.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance for environmental requirements.

Unique Advantages

  • High logic density: 56,320 logic elements and 1,000,000 gates enable implementation of sizeable custom logic functions on a single device, reducing need for multiple ICs.
  • Significant on-chip memory: Approximately 0.20 Mbits of embedded RAM supports local data storage and reduces external memory dependency.
  • Generous I/O resources: 356 I/O pins accommodate broad connectivity needs for peripheral interfaces and parallel data paths.
  • Compact package footprint: 456-BBGA (456-PBGA, 35×35) surface-mount package helps minimize PCB area while delivering high pin count.
  • Commercial readiness: Designed for 0 °C to 70 °C operation and RoHS compliance, suitable for mainstream electronic products and assemblies.

Why Choose APA1000-BG456?

The APA1000-BG456 delivers a balance of high logic capacity, on-chip memory and extensive I/O in a compact BGA package, making it a solid choice for designers who need to consolidate complex digital functions into a single FPGA. Its voltage and temperature specifications align with standard commercial systems, and RoHS compliance supports environmental requirements.

This device is suited for teams and projects that require scalable programmable logic resources, significant embedded RAM and high I/O density while maintaining a compact board-level footprint and surface-mount assembly.

Request a quote or submit an inquiry to receive pricing and availability information for the APA1000-BG456.

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