APA1000-BG456
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA |
|---|---|
| Quantity | 73 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 456-PBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 356 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 202752 |
Overview of APA1000-BG456 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA
The APA1000-BG456 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology providing high-density programmable logic in a commercial-grade, surface-mount package. It combines 56,320 logic elements, approximately 0.20 Mbits of embedded memory and 356 I/O to support complex, custom digital designs.
Designed for applications that require significant logic capacity and abundant I/O within a compact 456-ball BGA footprint, the device operates from a 2.3 V to 2.7 V supply and over a 0 °C to 70 °C commercial temperature range.
Key Features
- Core Logic 56,320 logic elements and 1,000,000 logic gates provide substantial on-chip programmable logic resources for complex designs.
- Embedded Memory 202,752 total RAM bits, approximately 0.20 Mbits of embedded memory to support buffering, state machines and on-chip data storage.
- I/O Capacity 356 I/O pins to support wide parallel interfaces, multiple peripherals and extensive board-level connectivity.
- Power Single supply voltage range of 2.3 V to 2.7 V to match systems designed around low-voltage domains.
- Package & Mounting 456-BBGA package (supplier device package: 456-PBGA, 35×35) in a surface-mount form factor for compact board integration.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance for environmental requirements.
Unique Advantages
- High logic density: 56,320 logic elements and 1,000,000 gates enable implementation of sizeable custom logic functions on a single device, reducing need for multiple ICs.
- Significant on-chip memory: Approximately 0.20 Mbits of embedded RAM supports local data storage and reduces external memory dependency.
- Generous I/O resources: 356 I/O pins accommodate broad connectivity needs for peripheral interfaces and parallel data paths.
- Compact package footprint: 456-BBGA (456-PBGA, 35×35) surface-mount package helps minimize PCB area while delivering high pin count.
- Commercial readiness: Designed for 0 °C to 70 °C operation and RoHS compliance, suitable for mainstream electronic products and assemblies.
Why Choose APA1000-BG456?
The APA1000-BG456 delivers a balance of high logic capacity, on-chip memory and extensive I/O in a compact BGA package, making it a solid choice for designers who need to consolidate complex digital functions into a single FPGA. Its voltage and temperature specifications align with standard commercial systems, and RoHS compliance supports environmental requirements.
This device is suited for teams and projects that require scalable programmable logic resources, significant embedded RAM and high I/O density while maintaining a compact board-level footprint and surface-mount assembly.
Request a quote or submit an inquiry to receive pricing and availability information for the APA1000-BG456.

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