APA1000-BGG456I

The APA1000-BGG456I is a ProASICPLUS field programmable gate array (FPGA) IC designed for applications that require substantial logic capacity and a high I/O count in an industrial-grade package. It integrates 56,320 logic elements and approximately 0.2 Mbits of embedded memory to support complex custom logic and buffering requirements.

With a 356-pin I/O capability, a 456-BBGA package (supplier device package: 456-PBGA (35×35)), and operation across a 2.3 V to 2.7 V supply range, this device targets designs where dense I/O, compact packaging, and industrial temperature operation are key requirements.

Key Features

• Core & Logic  56,320 logic elements provide a large fabric for implementing custom digital functions and complex state machines.
• Embedded Memory  Approximately 0.2 Mbits (202,752 total RAM bits) of on-chip memory for data buffering, FIFOs, and small local storage.
• I/O Capacity  356 general-purpose I/O pins support dense peripheral integration and multiple external interfaces.
• Gate Count  1,000,000 gates to support sizeable combinational and sequential logic implementations.
• Package & Mounting  456-BBGA package; supplier device package listed as 456-PBGA (35×35). Surface-mount mounting type for compact PCB integration.
• Power  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 85 °C for use in harsher environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Custom logic, protocol translation, and I/O aggregation where industrial temperature range and a high I/O count are required.
• High-density I/O Systems  Signal conditioning, bus bridging, or front-end aggregation that benefit from 356 available I/O pins.
• Embedded Logic and Buffering  Designs that use on-chip memory (approximately 0.2 Mbits) for temporary storage, FIFOs, or small data buffers.
• Compact Board-level Solutions  Space-constrained systems that require a surface-mount 456-BBGA/456-PBGA (35×35) package with significant logic capacity.

Unique Advantages

• High logic density: 56,320 logic elements and 1,000,000 gates enable substantial implementation of custom functions without external ASICs or CPLDs.
• Large I/O complement: 356 I/O pins simplify integration of multiple peripherals and parallel interfaces, reducing the need for external multiplexers.
• On-chip embedded memory: Approximately 0.2 Mbits of RAM supports local buffering and state storage, minimizing external memory dependence.
• Industrial temperature rating: Rated from −40 °C to 85 °C for reliable operation in demanding environments.
• Compact, surface-mount packaging: 456-BBGA / 456-PBGA (35×35) packaging enables dense, space-efficient board layouts.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose APA1000-BGG456I?

The APA1000-BGG456I combines a high count of logic elements and on-chip memory with a large I/O complement and an industrial temperature rating, delivering a compact, surface-mount FPGA solution for demanding embedded designs. Its package and pin density make it appropriate for systems that require both extensive logic and substantial external connectivity in constrained board space.

This part is suited for engineers and procurement teams building industrial control systems, high-density I/O modules, and compact embedded platforms that need scalable logic capacity, local memory, and robust environmental capability backed by RoHS compliance.

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