APA1000-CGS624B

The APA1000-CGS624B is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology. It delivers a high‑density programmable fabric with 56,320 logic elements and approximately 1,000,000 gates, suited for complex custom digital designs.

Key attributes include approximately 0.20 Mbits of on‑chip RAM (202,752 bits), 440 I/O pins, a 624‑BCCGA package, through‑hole mounting, military grade construction, a 2.3 V to 2.7 V supply window and a broad operating range of -55°C to 125°C—making it appropriate for high‑reliability and rugged environments.

Key Features

• Core Logic 56,320 logic elements (cells) and approximately 1,000,000 gates for implementing large, custom digital functions.
• Embedded Memory Approximately 0.20 Mbits of on‑chip RAM (202,752 bits) to support buffering, state storage and local data processing.
• High I/O Count 440 I/O pins to support complex board-level connectivity and multiple parallel interfaces.
• Power Operates from a 2.3 V to 2.7 V supply range to match system power rails within that window.
• Package & Mounting 624‑BCCGA package (supplier device package: 624‑CCGA (32.5×32.5)) with through‑hole mounting.
• Temperature & Grade Military grade device rated for an operating temperature range of -55°C to 125°C.
• Environmental Compliance RoHS compliant for materials and manufacturing processes.

Typical Applications

• Military and defense systems — Leverages military grade construction and a -55°C to 125°C operating range for designs requiring wide temperature tolerance and robustness.
• High‑density digital logic — Uses 56,320 logic elements and ~1,000,000 gates to implement complex, custom processing, protocol bridging or control logic on a single device.
• Memory‑assisted designs — Incorporates approximately 0.20 Mbits of embedded RAM for local buffering, FIFOs or state machines in timing‑sensitive applications.
• High‑pin‑count I/O systems — 440 I/O pins accommodate multiple parallel interfaces, wide bus connections, and high connector counts on board layouts.

Unique Advantages

• High integration density: 56,320 logic elements and ~1,000,000 gates enable consolidation of multiple functions into a single FPGA, reducing board complexity.
• Substantial on‑chip memory: Approximately 0.20 Mbits of embedded RAM supports local data handling and reduces dependence on external memory components.
• Large I/O resource: 440 I/O pins provide flexibility for complex interfacing without extensive external multiplexing.
• Rugged operating range: Military grade rating and -55°C to 125°C operation support deployments in demanding thermal environments.
• Form factor options: 624‑BCCGA package and 624‑CCGA supplier package footprint (32.5×32.5) allow integration into high‑pin‑count board designs.
• Regulatory alignment: RoHS compliance simplifies adoption where restricted materials rules apply.

Why Choose APA1000-CGS624B?

The APA1000-CGS624B positions itself as a high‑density, rugged FPGA choice for engineers who need substantial logic resources, significant on‑chip RAM, and a large I/O complement in a robust package. Its military grade construction and wide operating temperature range make it suitable for challenging environments where reliability and thermal tolerance are critical.

This device is appropriate for design teams working on complex, custom digital systems that require consolidation of functions, reduced board-level complexity, and predictable electrical characteristics within a 2.3 V to 2.7 V supply window. Combined with Microchip Technology’s product family support, the APA1000-CGS624B offers long‑term continuity for demanding applications.

Request a quote or contact sales to discuss pricing, availability and how the APA1000-CGS624B can be applied to your next design.