APA1000-BG456M

The APA1000-BG456M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, provided in a 456-ball BGA package. It combines a high logic capacity with a large I/O count and is qualified to military standards for use in demanding environments.

With 56,320 logic elements, approximately 0.2 Mbits of embedded memory, and 356 I/Os, this device is suited for complex embedded processing, control, and interface applications that require MIL-STD-883 qualification, extended temperature range, and robust electrical characteristics.

Key Features

• Core Logic  56,320 logic elements (cells) providing up to 1,000,000 equivalent gates for implementing complex digital designs.
• Embedded Memory  Approximately 0.2 Mbits of on-chip RAM (202,752 total RAM bits) to support buffering, FIFOs, and local data storage.
• I/O Capacity  356 user I/Os to interface with multiple peripherals, sensors, and external devices.
• Package and Mounting  456-ball BGA package (supplier device package listed as 456-PBGA, 35×35); surface-mount mounting type for compact PCB designs.
• Power  Operates from a 2.3 V to 2.7 V supply range to match system power rails.
• Temperature and Qualification  Military grade operation from −55 °C to 125 °C and qualified to MIL-STD-883 for use in high-reliability applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Military & Aerospace Systems  MIL-STD-883 qualification and wide operating temperature make this FPGA suitable for avionics, tactical electronics, and ruggedized control systems.
• Embedded Control  High logic density and abundant I/Os enable motor control, deterministic control logic, and real-time system orchestration in embedded platforms.
• Sensor and Interface Aggregation  Large I/O count supports aggregation and preprocessing of multiple sensor streams and external interfaces before passing data to system processors.

Unique Advantages

• High integration density: 56,320 logic elements and 1,000,000 gates-equivalent reduce the need for multiple discrete components and simplify system architecture.
• On-chip memory for local buffering: Approximately 0.2 Mbits of embedded RAM supports local data handling and latency-sensitive functions without external memory.
• Extensive I/O resources: 356 I/Os provide flexibility for multi-channel interfacing, allowing consolidation of signals and peripherals onto a single device.
• Rugged qualification: Military grade and MIL-STD-883 qualification provide traceable reliability for applications requiring stringent screening.
• Wide operating range: Support for 2.3 V to 2.7 V supply and operation from −55 °C to 125 °C enables deployment in thermally and electrically constrained environments.
• Compact board footprint: 456-ball BGA packaging (35×35) enables high-density PCB layouts while maintaining robust I/O connectivity.

Why Choose APA1000-BG456M?

The APA1000-BG456M positions itself as a high-capacity, military-qualified FPGA for designs that demand substantial logic resources, extensive I/O, and proven qualification for harsh environments. Backed by Microchip Technology, it delivers a combination of integration, temperature robustness, and qualification that supports long-life, high-reliability programs.

This device is well suited for engineers and procurement teams designing rugged embedded systems, airborne electronics, and other applications where MIL-STD-883 screening, wide temperature range, and compact packaging are required. Its feature set helps reduce BOM complexity while providing the on-chip resources needed for advanced control and interfacing tasks.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the APA1000-BG456M.