APA1000-BGG456M

The APA1000-BGG456M is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, provided in a 456-ball BGA package. It delivers high gate count and a large logic element complement in a surface-mount, military-qualified device.

With 56320 logic elements, approximately 0.203 Mbits of embedded memory, 356 I/O pins, and MIL-STD-883 qualification, this device is specified for applications requiring ruggedized performance across a wide operating temperature range and a 2.3 V to 2.7 V supply domain.

Key Features

• Core Logic  Contains 56320 logic elements providing up to 1,000,000 gates of programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 0.203 Mbits of on-chip RAM suitable for local buffering and state storage.
• I/O Density  356 user I/O pins to support high-density external interfacing and multiple peripheral connections.
• Power  Operates from a 2.3 V to 2.7 V supply range to match lower-voltage system domains.
• Package and Mounting  Available in a 456-ball BGA (456-PBGA, 35×35 mm) surface-mount package for compact board integration.
• Industrial/Military Qualification  Grade: Military with MIL-STD-883 qualification for environments requiring formal microelectronic reliability testing.
• Operating Temperature  Specified for −55 °C to 125 °C operation to support wide-temperature deployments.
• Regulatory Compliance  RoHS-compliant for materials and environmental consistency.

Typical Applications

• Military and Rugged Systems  Designed for use in systems that require MIL-STD-883 qualification and wide-temperature operation from −55 °C to 125 °C.
• High-density I/O Control  Supports applications needing many external interfaces with its 356 I/O pins for sensor, actuator, or bus connectivity.
• On-chip Data Buffering  Provides approximately 0.203 Mbits of embedded memory for local storage and buffering in embedded processing tasks.

Unique Advantages

• High logic capacity: 56320 logic elements and 1,000,000 gates enable implementation of complex digital functions within a single FPGA device.
• Rugged qualification: MIL-STD-883 qualification and military grade designation support deployment in demanding environments where formal qualification is required.
• Wide temperature range: Rated from −55 °C to 125 °C to ensure consistent operation across extreme ambient conditions.
• Compact BGA footprint: 456-ball BGA (35×35 mm) packaging delivers a high-pin-count solution while minimizing board real estate.
• Low-voltage operation: 2.3 V to 2.7 V supply range accommodates lower-voltage system designs.
• RoHS compliant: Conforms to RoHS requirements for materials and environmental compliance.

Why Choose APA1000-BGG456M?

The APA1000-BGG456M positions itself as a military-qualified FPGA option that combines substantial programmable logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its specified temperature range and MIL-STD-883 qualification make it suitable for applications where environmental robustness and formal device qualification are important design considerations.

Backed by Microchip Technology, this device is appropriate for engineering teams and procurement organizations seeking a ruggedized, high-density FPGA that fits into low-voltage system domains while delivering on-chip resources for complex logic integration.

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