APA1000-CGS624M
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 440 202752 624-BCCGA |
|---|---|
| Quantity | 1,091 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 64 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 624-CCGA (32.5x32.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 624-BCCGA | Number of I/O | 440 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Through Hole | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 202752 |
Overview of APA1000-CGS624M – ProASICPLUS FPGA, 56,320 logic elements, 440 I/O
The APA1000-CGS624M is a ProASICPLUS Field Programmable Gate Array (FPGA) designed for military-grade applications. It integrates 56,320 logic elements, approximately 0.203 Mbits of embedded memory, and up to 440 general-purpose I/O to support complex, high‑density logic designs.
Packaged in a 624-BCCGA / 624-CCGA form factor (32.5 × 32.5 mm) with through-hole mounting, the device operates from 2.3 V to 2.7 V and is qualified to MIL-STD-883 for use across an extended temperature range of −55 °C to 125 °C.
Key Features
- Core Logic 56,320 logic elements (cells) and approximately 1,000,000 gates provide capacity for dense logic implementations and complex state machines.
- Embedded Memory Approximately 0.203 Mbits of on-chip RAM (202,752 total RAM bits) for buffering, lookup tables, and small data stores.
- I/O Density 440 I/O pins to support broad interfacing requirements and multi-channel connectivity.
- Power Single-supply operation from 2.3 V to 2.7 V simplifies power-rail design and system integration.
- Package & Mounting 624-BCCGA / 624-CCGA package with a 32.5 × 32.5 mm footprint and through-hole mounting for mechanical robustness in demanding assemblies.
- Qualification & Grade Military grade device qualified to MIL-STD-883, suitable for applications requiring proven ruggedness and traceable qualification.
- Temperature Range Rated for operation from −55 °C to 125 °C to meet extended-environment requirements.
- Compliance RoHS compliant material status for environmental and regulatory alignment.
Typical Applications
- Military and Aerospace Systems Military-grade qualification and wide temperature range make this FPGA appropriate for avionics and defense electronics requiring reliable, qualified components.
- Rugged Embedded Control Through-hole package and extended thermal tolerance suit systems deployed in harsh or high-vibration environments.
- High-Density I/O Designs 440 I/O pins enable multiplexed sensor interfaces, bus bridging, and multi-channel peripheral control within constrained board layouts.
Unique Advantages
- High Logic Capacity: 56,320 logic elements and 1,000,000 gates provide substantial on-chip resources for complex FPGA designs without external logic.
- On-Chip Memory for Data Handling: Approximately 0.203 Mbits of embedded RAM supports buffering and small lookup-table requirements without additional memory chips.
- Wide Operating Temperature: −55 °C to 125 °C rating enables deployment in extreme-temperature applications with consistent performance.
- Military Qualification: MIL-STD-883 qualification and military grade designation offer traceable quality and suitability for defense-related procurement.
- Robust Mechanical Option: Through-hole mounting in a 624-CCGA package provides mechanical stability for board-level assemblies in demanding environments.
- Regulatory Alignment: RoHS compliance supports environmentally regulated programs and simplifies qualification processes.
Why Choose APA1000-CGS624M?
The APA1000-CGS624M positions itself as a rugged, high-capacity FPGA option for designers requiring military-grade qualification, extensive logic resources, and substantial I/O capability. Its combination of 56,320 logic elements, significant on-chip RAM, and a wide operating temperature range makes it suited for demanding embedded systems where reliability and proven qualification are priorities.
This device is ideal for engineering teams building mission-critical applications that need long-term availability, robust mechanical mounting, and a qualified component backbone for regulated procurement and deployment environments.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for APA1000-CGS624M. Our team can help coordinate procurement and answer questions specific to your application requirements.

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