APA1000-CGS624M

IC FPGA 440 I/O 624CCGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 440 202752 624-BCCGA

Quantity 1,091 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time64 Weeks
Datasheet

Specifications & Environmental

Device Package624-CCGA (32.5x32.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case624-BCCGANumber of I/O440Voltage2.3 V - 2.7 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56320Number of Logic Elements/Cells56320
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits202752

Overview of APA1000-CGS624M – ProASICPLUS FPGA, 56,320 logic elements, 440 I/O

The APA1000-CGS624M is a ProASICPLUS Field Programmable Gate Array (FPGA) designed for military-grade applications. It integrates 56,320 logic elements, approximately 0.203 Mbits of embedded memory, and up to 440 general-purpose I/O to support complex, high‑density logic designs.

Packaged in a 624-BCCGA / 624-CCGA form factor (32.5 × 32.5 mm) with through-hole mounting, the device operates from 2.3 V to 2.7 V and is qualified to MIL-STD-883 for use across an extended temperature range of −55 °C to 125 °C.

Key Features

  • Core Logic  56,320 logic elements (cells) and approximately 1,000,000 gates provide capacity for dense logic implementations and complex state machines.
  • Embedded Memory  Approximately 0.203 Mbits of on-chip RAM (202,752 total RAM bits) for buffering, lookup tables, and small data stores.
  • I/O Density  440 I/O pins to support broad interfacing requirements and multi-channel connectivity.
  • Power  Single-supply operation from 2.3 V to 2.7 V simplifies power-rail design and system integration.
  • Package & Mounting  624-BCCGA / 624-CCGA package with a 32.5 × 32.5 mm footprint and through-hole mounting for mechanical robustness in demanding assemblies.
  • Qualification & Grade  Military grade device qualified to MIL-STD-883, suitable for applications requiring proven ruggedness and traceable qualification.
  • Temperature Range  Rated for operation from −55 °C to 125 °C to meet extended-environment requirements.
  • Compliance  RoHS compliant material status for environmental and regulatory alignment.

Typical Applications

  • Military and Aerospace Systems  Military-grade qualification and wide temperature range make this FPGA appropriate for avionics and defense electronics requiring reliable, qualified components.
  • Rugged Embedded Control  Through-hole package and extended thermal tolerance suit systems deployed in harsh or high-vibration environments.
  • High-Density I/O Designs  440 I/O pins enable multiplexed sensor interfaces, bus bridging, and multi-channel peripheral control within constrained board layouts.

Unique Advantages

  • High Logic Capacity: 56,320 logic elements and 1,000,000 gates provide substantial on-chip resources for complex FPGA designs without external logic.
  • On-Chip Memory for Data Handling: Approximately 0.203 Mbits of embedded RAM supports buffering and small lookup-table requirements without additional memory chips.
  • Wide Operating Temperature: −55 °C to 125 °C rating enables deployment in extreme-temperature applications with consistent performance.
  • Military Qualification: MIL-STD-883 qualification and military grade designation offer traceable quality and suitability for defense-related procurement.
  • Robust Mechanical Option: Through-hole mounting in a 624-CCGA package provides mechanical stability for board-level assemblies in demanding environments.
  • Regulatory Alignment: RoHS compliance supports environmentally regulated programs and simplifies qualification processes.

Why Choose APA1000-CGS624M?

The APA1000-CGS624M positions itself as a rugged, high-capacity FPGA option for designers requiring military-grade qualification, extensive logic resources, and substantial I/O capability. Its combination of 56,320 logic elements, significant on-chip RAM, and a wide operating temperature range makes it suited for demanding embedded systems where reliability and proven qualification are priorities.

This device is ideal for engineering teams building mission-critical applications that need long-term availability, robust mechanical mounting, and a qualified component backbone for regulated procurement and deployment environments.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for APA1000-CGS624M. Our team can help coordinate procurement and answer questions specific to your application requirements.

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