APA1000-CQ208B
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 202752 208-BFCQFP with Tie Bar |
|---|---|
| Quantity | 1,206 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 40 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFCQFP with Tie Bar | Number of I/O | 158 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 202752 |
Overview of APA1000-CQ208B – ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 202752 208-BFCQFP with Tie Bar
The APA1000-CQ208B is a ProASICPLUS Field Programmable Gate Array (FPGA) IC manufactured by Microchip Technology. It delivers a high-density programmable logic fabric with substantial on-chip memory and a wide operating temperature range for demanding environments.
With 56,320 logic elements, approximately 0.203 Mbits of embedded memory, 158 I/O and a 1,000,000-gate capacity, the device targets designs that require significant logic capacity, ample I/O and military-grade temperature performance while operating from a 2.3 V to 2.7 V supply.
Key Features
- Core Logic 56,320 logic elements for implementing complex digital functions and state machines.
- On-chip Memory Approximately 0.203 Mbits of embedded memory (202,752 bits) for buffering, lookup tables and state storage.
- Gate Capacity 1,000,000 gates to support dense combinational and sequential logic designs.
- I/O Count 158 user I/O pins to interface with peripherals, sensors and external devices.
- Voltage Supply Operates from 2.3 V to 2.7 V to match low-voltage system domains.
- Package & Mounting 208-BFCQFP with tie bar; supplier device package 208-CQFP (75x75); surface-mount technology.
- Temperature & Grade Military grade device with an operating temperature range of −55 °C to 125 °C.
- Environmental Compliance RoHS compliant for regulatory conformity.
Typical Applications
- Military and Aerospace Systems Deploy in subsystems that require military-grade temperature operation and high logic density.
- High-Density Logic Designs Implement complex state machines, protocol engines or custom datapaths using substantial logic and gate resources.
- Embedded Control and Interface Hubs Use the 158 I/O to aggregate sensors, actuators and peripheral interfaces in compact designs.
- Specialized Electronics Apply where a combination of logic capacity, on-chip memory and rugged temperature range is required.
Unique Advantages
- High Logic Integration: 56,320 logic elements and 1,000,000 gates enable consolidation of complex functions into a single FPGA, reducing board-level BOM and interconnect complexity.
- Meaningful Embedded Memory: Approximately 0.203 Mbits of on-chip RAM supports buffering and fast local data storage without external memory.
- Generous I/O Count: 158 I/O pins provide flexibility for multi-channel interfacing and high-pin-count peripheral connections.
- Military-Grade Temperature Range: Operates from −55 °C to 125 °C for deployment in temperature-extreme environments.
- Surface-Mount, Tie-Bar Package: 208-BFCQFP package with tie bar facilitates surface-mount assembly and handling in manufacturing.
- Low-Voltage Operation: 2.3 V to 2.7 V supply supports integration with low-voltage system domains.
Why Choose APA1000-CQ208B?
The APA1000-CQ208B combines high logic density, meaningful embedded memory and a broad I/O complement in a military-grade FPGA package from Microchip Technology. Its specifications make it well suited for designs where thermal robustness, on-chip resources and integration density are primary concerns.
This device is ideal for engineering teams building compact, rugged digital systems that require scalable logic capacity and reliable operation across an extended temperature range.
Request a quote or submit an inquiry to obtain pricing and availability for APA1000-CQ208B.

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