APA1000-FG896
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA |
|---|---|
| Quantity | 1,187 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 642 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 202752 |
Overview of APA1000-FG896 – ProASICPLUS Field Programmable Gate Array (FPGA) IC, 642 I/O, 896-BGA
The APA1000-FG896 is a ProASICPLUS FPGA from Microchip Technology designed for commercial embedded logic applications. It integrates 56,320 logic elements and approximately 0.203 Mbits of on-chip RAM to provide a configurable hardware platform for custom digital functions.
This surface-mount 896-FBGA (31×31) device offers 642 I/O pins, support for a 2.3 V to 2.7 V supply, and a commercial operating range of 0 °C to 70 °C, making it suitable for a wide range of standard electronic designs that require programmable logic density and moderate on-chip memory.
Key Features
- Logic Capacity 56,320 logic elements (LEs) provide substantial programmable logic resources, supporting complex custom logic and glue-logic functions.
- On‑Chip Memory Approximately 0.203 Mbits of embedded RAM (202,752 total RAM bits) for data buffering, state storage, and small look-up tables.
- I/O Density 642 general-purpose I/O pins to support extensive interfacing with external peripherals, sensors, and high-pin-count connectors.
- Gate Count 1,000,000 gates of logic capacity for integrating substantial digital functionality on a single device.
- Power Operates from a 2.3 V to 2.7 V supply range, enabling compatibility with a variety of system voltage architectures within that window.
- Package & Mounting 896-FBGA (31×31) surface-mount package provides a compact, high-pin-count footprint for board-level integration.
- Temperature & Grade Commercial grade device rated for 0 °C to 70 °C operation, suitable for standard commercial products and environments.
- Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing processes.
Typical Applications
- Configurable Logic and Glue-Logic Implement custom combinational and sequential logic to consolidate discrete components and simplify PCB design.
- Interface Bridging Provide signal translation and protocol bridging with high I/O count for multi-interface systems.
- Prototyping and Development Use the FPGA’s programmable resources and on-chip memory for iterative hardware development and proof-of-concept designs.
Unique Advantages
- Substantial Logic Density: 56,320 logic elements and 1,000,000 gates allow consolidation of multiple functions into a single device, reducing bill-of-materials and board complexity.
- High I/O Count: 642 I/O pins enable broad external connectivity without external multiplexers or expanders.
- Compact High-Pin Package: The 896-FBGA (31×31) package delivers high pin density in a compact footprint for space-constrained designs.
- Embedded Memory: Approximately 0.203 Mbits of on-chip RAM supports data buffering and small state machines without external memory.
- Commercial-Focus: A commercial operating range and RoHS compliance align the device with mainstream electronic product requirements.
Why Choose APA1000-FG896?
The APA1000-FG896 positions itself as a dense, commercially graded FPGA option for designers who need substantial logic resources, high I/O counts, and on-chip memory in a compact FBGA package. Its combination of logic elements, gate count, and embedded RAM supports consolidation of discrete logic and enables flexible, hardware-configurable solutions.
This device is well suited for development teams and product designs that prioritize integration, board-level space savings, and the ability to reprogram logic as design requirements evolve. Backed by Microchip Technology manufacturing and RoHS compliance, the APA1000-FG896 offers a reliable, long-term programmable logic option for commercial electronic products.
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