APA1000-FGG1152

The APA1000-FGG1152 is a ProASICPLUS field programmable gate array (FPGA) offered in a 1152-ball BGA package. It provides a high-density combination of logic resources, I/O capacity and embedded memory for commercial embedded designs.

Key on-chip resources include 56,320 logic elements, approximately 0.203 Mbits of embedded memory, 712 user I/O pins and support for a 2.3 V to 2.7 V supply. The device is supplied in a 1152-FPBGA (35×35) package and is specified for commercial temperature operation from 0 °C to 70 °C.

Key Features

• Core Logic – 56,320 logic elements (LEs) providing a large programmable fabric for implementing complex digital functions.
• On-chip Memory – Approximately 0.203 Mbits of embedded RAM bits for buffering, FIFOs and small data stores directly in the FPGA fabric.
• I/O Capacity – 712 user I/O pins to support high-density external interfacing and multiple peripheral connections.
• Gate Count – 1,000,000 gates to indicate the overall integration scale available on-chip.
• Power and Supply – Operates from a 2.3 V to 2.7 V supply range for system power planning.
• Package and Mounting – Supplied in a 1152-FPBGA (35×35) / 1152-BGA package for surface-mount PCB assembly.
• Temperature Grade – Commercial grade operation from 0 °C to 70 °C.
• Environmental Compliance – RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density I/O systems – The 712 I/O pins allow the FPGA to interface with many peripherals and parallel buses in space-constrained boards.
• Embedded processing and control – 56,320 logic elements and on-chip RAM support implementing custom control, signal-processing blocks, and glue logic.
• Multi-function boards – Large gate count and logic resources let designers consolidate multiple functions into a single programmable device to reduce BOM count.

Unique Advantages

• High integration density: 56,320 logic elements and 1,000,000 gates enable consolidation of complex digital functions into a single device, simplifying board-level design.
• Substantial I/O capacity: 712 user I/Os provide flexibility for connecting numerous external interfaces without additional multiplexing logic.
• Embedded memory on board: Approximately 0.203 Mbits of on-chip RAM allows local buffering and data handling close to the logic, reducing external memory dependency.
• Compact BGA package: The 1152-FPBGA (35×35) package supports high pin-count routing in a compact surface-mount form factor suitable for dense PCBs.
• RoHS compliant: Conforms to RoHS for use in designs requiring lead-free component selection.
• Commercial temperature specification: Rated for 0 °C to 70 °C operation to match typical commercial-class application environments.

Why Choose APA1000-FGG1152?

The APA1000-FGG1152 positions itself as a high-density ProASICPLUS FPGA option for commercial embedded designs that demand a large logic fabric, extensive I/O and on-chip memory in a compact BGA package. Its combination of 56,320 logic elements, 712 I/Os and approximately 0.203 Mbits of embedded RAM supports integration of multiple functions and reduces external component count.

Engineers and procurement teams targeting commercial temperature applications will find this device suitable for consolidating logic, implementing complex control and interfacing with numerous peripherals while maintaining RoHS compliance and a surface-mount BGA footprint.

Request a quote or submit an inquiry to obtain pricing, availability and delivery details for the APA1000-FGG1152.