APA1000-FGG896I

The APA1000-FGG896I is a ProASICPLUS family FPGA from Microchip Technology, offering a high-density programmable logic device in an 896-ball BGA package. It combines a large number of logic elements with substantial I/O capacity and embedded memory, targeting designs that require significant on-chip logic and connectivity within an industrial temperature range.

Key Features

• Core Logic 56,320 logic elements (LEs) and approximately 1,000,000 gates provide extensive programmable logic resources for complex logic implementation.
• Embedded Memory Approximately 0.20 Mbits (202,752 bits) of on-chip RAM to support data buffering, state machines, and local storage.
• I/O Density 642 I/O pins offer high connectivity for interfacing with multiple peripherals, sensors, and system buses.
• Power Supply Single-supply operation from 2.3 V to 2.7 V simplifies power rail planning for the core device.
• Package & Mounting 896-ball BGA package (896-FBGA, 31×31 mm) designed for surface-mount assembly to support compact board layouts.
• Industrial Temperature Range Rated for operation from -40 °C to 85 °C, suitable for industrial environments and temperature-sensitive deployments.
• RoHS Compliant Conforms to RoHS requirements for environmentally conscious designs.

Typical Applications

• Industrial Control — High logic capacity and industrial temperature rating make the device suitable for programmable control, IO aggregation, and custom timing logic in industrial equipment.
• High‑Density I/O Systems — Large 642-pin I/O count supports systems requiring broad peripheral connectivity and parallel interfaces.
• Embedded Logic & Prototyping — Substantial logic elements and on-chip RAM enable implementation of custom state machines, glue logic, and prototype hardware accelerators.
• Test & Measurement — The combination of logic density and I/O flexibility suits instrumentation that needs customizable signal processing and measurement control.

Unique Advantages

• High logic integration: 56,320 logic elements enable complex designs to be implemented on a single device, reducing board-level component count.
• Extensive I/O capacity: 642 I/Os support large sensor arrays, parallel buses, and mixed-signal interfacing without external expanders.
• On-chip memory: Approximately 0.20 Mbits of embedded RAM provide local storage for buffering and state information, simplifying system memory architecture.
• Industrial-grade operation: -40 °C to 85 °C rating allows deployment in a wide range of industrial environments.
• Compact BGA footprint: 896-ball FBGA (31×31 mm) balances pin count and board real estate for dense, reliable surface-mount designs.
• Regulatory friendliness: RoHS compliance supports environmentally conscious manufacturing and end-product compliance needs.

Why Choose APA1000-FGG896I?

The APA1000-FGG896I delivers a balance of programmable logic capacity, extensive I/O, and embedded memory in a single industrial-grade FPGA package. Its specifications—56,320 logic elements, 642 I/Os, approximately 0.20 Mbits of on-chip RAM, and operation from 2.3 V to 2.7 V—make it appropriate for systems that require substantial on-chip resources and reliable operation across industrial temperature ranges.

Manufactured by Microchip Technology and supplied in a compact 896-FBGA package, this device is suited to engineers designing industrial control systems, high-density I/O platforms, embedded logic solutions, and test equipment where integration, connectivity, and temperature robustness are key considerations.

Request a quote or contact sales to check availability, pricing, and lead times for the APA1000-FGG896I.