APA1000-FGG896M

The APA1000-FGG896M is a ProASICPLUS Field Programmable Gate Array (FPGA) from Microchip Technology, offered in an 896‑FBGA (31×31) surface-mount package. It integrates a high logic density fabric with extensive I/O and embedded memory to support complex programmable logic and I/O-centric designs.

Qualified to MIL-STD-883 and specified for a wide operating range of −55 °C to 125 °C, this military-grade FPGA is suited for applications that require rugged performance, high I/O count and deterministic on-chip resources while operating from a 2.3 V to 2.7 V supply.

Key Features

• Logic Density: Provides 56,320 logic elements (LEs) and approximately 1,000,000 gates to implement complex digital functions and custom processing pipelines.
• Embedded Memory: Includes 202,752 bits of on-chip RAM (approximately 0.203 Mbits) for buffering, state storage and small local data structures.
• High I/O Count: 642 I/O pins support extensive external interfacing and parallel connectivity for dense sensor, control and communication interfaces.
• Package and Mounting: Available in an 896‑BGA / 896‑FBGA (31×31) surface-mount package to balance high pin count with a compact board footprint.
• Voltage Supply: Operates from a 2.3 V to 2.7 V supply domain, enabling consistent supply planning for system designers.
• Rugged Qualification: Military grade construction with MIL-STD-883 qualification and a −55 °C to 125 °C operating range for demanding environments.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Military and Defense Systems — Use in ruggedized electronic subsystems where MIL-STD-883 qualification and wide temperature tolerance are required.
• Rugged Embedded Control — High logic density and abundant I/O enable complex control algorithms and extensive peripheral interfacing in harsh environments.
• High‑I/O Signal Aggregation — 642 I/Os support consolidation of multiple sensor, actuator or communication channels onto a single programmable device.

Unique Advantages

• High logic capacity: 56,320 logic elements and ~1,000,000 gates provide headroom for complex, multi-function designs without external logic proliferation.
• Extensive I/O resources: 642 I/Os reduce the need for additional interface components and simplify board-level routing for I/O-intensive applications.
• Qualified for harsh environments: MIL-STD-883 qualification and a −55 °C to 125 °C operating range support use in temperature- and reliability-sensitive deployments.
• Compact high-pin-count package: 896‑FBGA (31×31) offers a dense pinout in a manageable footprint for space-constrained boards.
• Predictable supply domain: 2.3 V to 2.7 V operating range makes power sequencing and domain planning straightforward for system integrators.
• RoHS compliant: Supports lead-free manufacturing and regulatory compliance objectives.

Why Choose APA1000-FGG896M?

The APA1000-FGG896M positions itself as a rugged, high‑density programmable solution for designs that require significant logic resources, exceptional I/O capacity and military-grade qualification. Its combination of 56,320 logic elements, substantial on-chip RAM and 642 I/Os provides a strong foundation for consolidating functions and reducing external component count.

This FPGA is ideal for engineers developing defense or other rugged embedded systems that demand wide temperature operation, MIL-STD-883 qualification and compact, high‑pin-count packaging. The APA1000-FGG896M delivers integration, reproducible supply characteristics and environmental compliance to support long-term deployment and lifecycle planning.

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