APA1000-FGG1152I

The APA1000-FGG1152I is a ProASICPLUS Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 1152-BGA package. It provides a combination of substantial logic capacity, a high I/O count and on-chip RAM suitable for industrial applications requiring dense interfacing and mid-range logic integration.

Key characteristics include 56,320 logic elements, approximately 0.203 Mbits of embedded memory, 712 user I/Os, and an industrial operating temperature range, making the device appropriate for designs that require reliable operation across a wide temperature span and a compact surface-mount package.

Key Features

• Logic Capacity  56,320 logic elements support implementation of complex combinational and sequential logic functions within a single device.
• On‑Chip Memory  Approximately 0.203 Mbits of embedded RAM (202,752 bits) for buffering, state storage and small data structures without external memory.
• I/O Density  712 user I/Os provide a high pin count for interfacing with multiple peripherals, buses and high-density connectors.
• Gate Count  Around 1,000,000 gates to accommodate medium-complexity logic integration and system consolidation.
• Power  Operates from a 2.3 V to 2.7 V supply range, enabling compatibility with systems using similar core voltage domains.
• Package and Mounting  1152-BGA (supplier package: 1152-FPBGA, 35×35 mm) for compact surface-mount assembly and high signal routing density.
• Industrial Temperature Rating  Rated for operation from −40 °C to 85 °C to meet thermal requirements of industrial environments.
• RoHS Compliance  RoHS compliant construction for regulatory and environmental compatibility.

Typical Applications

• Industrial Control  Used in control systems where robust logic capacity and industrial temperature range are required for motor control, PLC functions, or discrete I/O aggregation.
• High‑Density I/O Systems  Suitable for applications that require many external connections, such as interface hubs, protocol bridging, and large sensor arrays, leveraging 712 I/Os.
• Embedded Logic Integration  Ideal for consolidating multiple glue-logic functions and state machines into a single device using the device’s 56,320 logic elements and on‑chip RAM.

Unique Advantages

• High Logic Integration: 56,320 logic elements and roughly 1,000,000 gates enable substantial on‑chip functionality to reduce external components.
• Ample I/O Count: 712 user I/Os support dense peripheral and bus interfacing, simplifying board-level routing for complex systems.
• On‑Chip Memory: Approximately 0.203 Mbits of embedded RAM provides local storage for buffering and control without adding external memory.
• Industrial Reliability: An operating range of −40 °C to 85 °C and RoHS compliance make the device suitable for industrial deployments that demand consistent operation and regulatory conformance.
• Compact BGA Packaging: The 1152-BGA (1152-FPBGA, 35×35) package delivers a high pin count in a compact surface-mount form factor for space-constrained designs.
• Defined Supply Range: Operates from 2.3 V to 2.7 V, enabling predictable integration with systems using similar core voltages.

Why Choose APA1000-FGG1152I?

The APA1000-FGG1152I from Microchip Technology positions itself as a solid option for designs needing a balance of logic capacity, high I/O density and industrial temperature capability. Its mix of 56,320 logic elements, approximately 0.203 Mbits of embedded RAM and 712 I/Os allows engineers to consolidate functions and reduce board-level complexity while retaining on-chip resources for control and buffering.

This device is well suited to engineers and procurement teams targeting industrial applications or other deployments that require a compact BGA footprint, surface-mount assembly, and defined electrical and thermal operating ranges. Backed by Microchip Technology, the APA1000-FGG1152I offers a verifiable specification set for medium-complexity FPGA integration.

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