APA1000-FG896M

The APA1000-FG896M is a ProASICPLUS Field Programmable Gate Array (FPGA) IC offering high logic density and a robust qualification profile. It provides 56,320 logic elements, approximately 0.20 Mbits of embedded memory, 642 I/O and 1,000,000 gates in a compact 896-BGA package.

Designed for applications that require MIL-STD-883 qualification, wide operating temperatures, and a high I/O count, this device targets military and other high-reliability embedded systems where integration and dependable operation across extreme conditions are priorities.

Key Features

• Core Logic — 56,320 logic elements and approximately 1,000,000 gates to implement complex digital functions and custom logic blocks.
• Embedded Memory — Approximately 0.20 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
• High I/O Count — 642 user I/O pins to support dense sensor, actuator, and bus interfacing in I/O‑heavy designs.
• Low-Voltage Supply — Operates from 2.3 V to 2.7 V, enabling compatibility with low-voltage system domains.
• Package and Mounting — 896-BGA supplier device package (896-FBGA 31 × 31), surface-mount mounting for compact board-level integration.
• Qualification and Reliability — Military grade with MIL-STD-883 qualification for applications requiring validated, rugged performance.
• Temperature Range — Rated for operation from −55 °C to 125 °C to support extreme-environment deployments.
• Environmental Compliance — RoHS compliant for restriction of hazardous substances.

Typical Applications

• Military and Defense Systems — Implement control logic, protocol bridging, and signal pre-processing with a device qualified to MIL-STD-883 and wide temperature operation.
• High‑Density I/O Interfaces — Serve as a central FPGA for boards requiring hundreds of I/O lines for sensors, transceivers, or I/O expansion.
• Embedded Processing and Control — Consolidate custom state machines, timing logic, and peripheral controllers using the device's large logic array and on‑chip RAM.
• Ruggedized Communication Modules — Provide protocol adaptation and front-end logic in communications equipment operating across extreme temperatures.

Unique Advantages

• High Integration Density: 56,320 logic elements and 1,000,000 gates reduce external components by consolidating multiple functions on-chip.
• Extensive I/O Capability: 642 I/O pins enable direct interfacing to a wide range of peripherals and high channel-count systems.
• Military Qualification: MIL-STD-883 qualification and military grade designation provide a verified baseline for high-reliability designs.
• Wide Operating Range: −55 °C to 125 °C rating supports deployment in extreme-temperature environments without additional thermal qualification.
• Compact, Surface-Mount Package: 896-FBGA (31 × 31) package offers a balance of board density and thermal/mechanical robustness for rugged applications.
• Regulatory Compliance: RoHS compliance simplifies environmental and end-product compliance planning.

Why Choose APA1000-FG896M?

The APA1000-FG896M positions itself for designs that demand substantial logic resources, a high I/O count, and verified military qualification. Its combination of 56,320 logic elements, substantial gate count, MIL-STD-883 qualification, and a wide −55 °C to 125 °C operating range make it suitable for high-reliability embedded and defense-focused applications where long-term robustness and integration matter.

Engineers and procurement teams looking to consolidate functionality, simplify board-level integration, and rely on proven qualification will find the APA1000-FG896M aligned with those priorities while providing RoHS compliance for regulatory alignment.

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