APA1000-FG896I

The APA1000-FG896I is a ProASICPLUS field programmable gate array (FPGA) packaged in an 896-ball BGA suitable for surface-mount assembly. It delivers high-density programmable logic with a large I/O complement and embedded memory for designs that require substantial on-chip resources within an industrial temperature envelope.

With 56,320 logic elements, approximately 0.203 Mbits of embedded memory and 642 I/O pins, this device targets applications needing dense logic integration, extensive interfacing and reliable operation across a -40 °C to 85 °C temperature range.

Key Features

• Core Logic  56,320 logic elements supporting complex programmable logic implementations and approximately 1,000,000 gates of capacity.
• On-chip Memory  Approximately 0.203 Mbits of total RAM bits for local data storage and buffering.
• I/O Density  642 general-purpose I/O pins to support high-connectivity system designs and multiple external interfaces.
• Power Supply  Operates from a 2.3 V to 2.7 V supply range to match compatible system power rails.
• Package and Mounting  896-ball FBGA (31 × 31 mm) package, surface-mount mounting type for compact board-level integration.
• Temperature and Grade  Industrial-grade operation from -40 °C to 85 °C for deployment in temperature-demanding environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control  Use where industrial-grade temperature support and dense logic are required to implement custom control and sequencing functions.
• High-density I/O Aggregation  Suitable for systems that require many external connections—642 I/O pins enable aggregation of sensors, actuators and peripheral interfaces.
• Custom Logic and Data Paths  The combination of 56,320 logic elements and embedded RAM supports implementation of tailored data processing and protocol handling.
• Compact Board Integration  The 896-FBGA (31 × 31 mm) package and surface-mount mounting enable space-efficient layouts on populated PCBs.

Unique Advantages

• High logic density: 56,320 logic elements and a 1,000,000-gate capacity provide the resources for complex implementations without partitioning across multiple devices.
• Large I/O count: 642 I/O pins reduce the need for external IO expanders and simplify board routing for multi-interface systems.
• Embedded RAM: Approximately 0.203 Mbits of on-chip memory supports local buffering and state storage, reducing dependence on external memory.
• Industrial temperature range: Specified operation from -40 °C to 85 °C enables deployment in thermally demanding environments.
• Compact BGA package: 896-FBGA (31 × 31) allows high integration density while maintaining a surface-mount form factor.
• RoHS compliant: Complies with RoHS requirements for lead-free manufacturing processes.

Why Choose APA1000-FG896I?

The APA1000-FG896I positions itself as a high-density ProASICPLUS FPGA option for designers who need substantial programmable logic, significant I/O capability and on-chip memory within an industrial temperature-rated, surface-mount BGA package. Its combination of logic elements, memory and I/O count supports consolidated designs that reduce external components and simplify system architecture.

This device is well suited for engineering teams building compact, robust FPGA-based solutions that require predictable supply-voltage operation (2.3 V–2.7 V) and RoHS compliance. It offers clear value for projects aiming to balance integration density, board-level footprint and industrial temperature operation.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the APA1000-FG896I. Our team will provide the details you need to move your design forward.