APA1000-FGG896

IC FPGA 642 I/O 896FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA

Quantity 975 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case896-BGANumber of I/O642Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56320Number of Logic Elements/Cells56320
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits202752

Overview of APA1000-FGG896 – ProASICPLUS Field Programmable Gate Array (896-BGA)

The APA1000-FGG896 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a hardware-configurable logic resource with 56,320 logic elements, approximately 0.203 Mbits of embedded memory, and a gate count of 1,000,000.

Designed as a commercial-grade, surface-mount device in an 896-BGA (896-FBGA, 31×31) package, the device offers 642 general-purpose I/Os, a 2.3 V to 2.7 V supply range, and an operating temperature range of 0 °C to 70 °C. The part is RoHS compliant.

Key Features

  • Core Capacity 56,320 logic elements and an internal gate equivalent of 1,000,000 provide substantial programmable logic for complex implementations.
  • Embedded Memory Total on-chip RAM of 202,752 bits (approximately 0.203 Mbits) for distributed storage and buffering within designs.
  • I/O Density 642 device I/Os support extensive external interfacing and parallel connectivity requirements.
  • Power and Voltage Operates from a 2.3 V to 2.7 V supply, enabling integration into low-voltage system domains.
  • Package and Mounting Available in an 896-BGA (supplier package 896-FBGA, 31×31) surface-mount package to support high-pin-count board layouts.
  • Operating Range and Grade Commercial-grade device rated for 0 °C to 70 °C operation.
  • Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assembly.

Unique Advantages

  • High Logic Density: 56,320 logic elements and 1,000,000 gates enable implementation of complex logic functions on a single device, reducing PCB count.
  • Substantial I/O Count: 642 I/Os allow extensive peripheral and subsystem connectivity without external multiplexing.
  • On-Chip Memory: Approximately 0.203 Mbits of embedded RAM supports local buffering, state storage, and small data tables to simplify system design.
  • Compact High-Pin Package: The 896-BGA (31×31) package delivers high pin count in a compact footprint suitable for dense PCB layouts.
  • Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility supports integration with low-voltage logic domains and power-optimized systems.
  • Regulatory Compliance: RoHS compliance helps streamline lead-free manufacturing and environmental conformity.

Why Choose APA1000-FGG896?

The APA1000-FGG896 positions itself as a high-capacity, commercial-grade ProASICPLUS FPGA for designs that require substantial programmable logic, large I/O counts, and on-chip memory within a compact BGA package. Its combination of 56,320 logic elements, approximately 0.203 Mbits of embedded RAM, and 642 I/Os makes it suitable for systems where integration and pin density are key considerations.

As a Microchip Technology device, the APA1000-FGG896 offers a defined electrical and thermal envelope—2.3 V to 2.7 V supply and 0 °C to 70 °C operation—along with RoHS compliance to support modern assembly processes. Choose this part when your design requires a commercially graded FPGA with high logic and I/O resources in an 896-BGA surface-mount package.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the APA1000-FGG896.

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