APA1000-LG624B

The APA1000-LG624B is a ProASICPLUS field programmable gate array from Microchip Technology, delivered in a 624-BCLGA surface-mount package. The device provides a dense logic implementation with a large I/O count and on-chip memory for use in systems that require configurable digital logic and high pin count integration.

Designed for applications that demand broad temperature range and military-grade qualification, this FPGA combines up to 1,000,000 gates, 56,320 logic elements, approximately 0.20 Mbits of embedded memory, and 440 I/O pins in a compact 32.5 × 32.5 mm package.

Key Features

• Logic Density  Up to 1,000,000 gates and 56,320 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 0.20 Mbits (202,752 bits) of on-chip RAM to support intermediate buffering, state machines, and small data structures.
• I/O Capacity  440 general-purpose I/O pins for high-pin-count interfacing to peripherals, buses, and external devices.
• Package & Mounting  624-BCLGA (624-CLGA, 32.5 × 32.5 mm) surface-mount package for dense board-level integration in space-constrained designs.
• Voltage Supply  Operates from 2.3 V to 2.7 V supply rails to match system power domains within that range.
• Temperature Range & Grade  Military-grade device rated for operation from −55 °C to 125 °C, suitable for demanding environmental conditions.

Typical Applications

• Military and Aerospace Systems  Use in rugged systems requiring military-grade temperature operation and reliable programmable logic for control, timing, and interface functions.
• High-Density I/O Control  Drives complex interface tasks and bus bridging where up to 440 I/O pins are needed for sensors, actuators, or multi-channel I/O.
• Custom Digital Processing  Implements application-specific accelerators, state machines, and glue logic leveraging the device’s large logic element count and on-chip RAM.
• Compact, High-Integration Designs  Fits designs that require significant logic capacity and memory in a compact 624-BCLGA package for space-constrained boards.

Unique Advantages

• High logic capacity: Up to 56,320 logic elements and 1,000,000 gates enable implementation of large, complex designs without external PLDs.
• Substantial I/O density: 440 I/O pins simplify system integration by reducing the need for external multiplexing or expanders.
• On-chip memory: Approximately 202,752 bits of embedded RAM provide local storage for buffering and control state, reducing external memory requirements.
• Military-grade thermal range: Rated for −55 °C to 125 °C operation, supporting deployments in extreme temperature environments.
• Compact BCLGA package: 624-CLGA (32.5 × 32.5 mm) enables high integration density on PCBs while maintaining robust mechanical mounting.
• Tightly specified supply range: 2.3 V to 2.7 V supply operation allows clear integration with systems using those voltage domains.

Why Choose APA1000-LG624B?

The APA1000-LG624B positions itself as a high-capacity, military-grade FPGA option for designs that require large programmable logic resources, substantial on-chip memory, and a high number of I/O pins in a compact package. Its specified operating range and package make it suitable for applications where environmental robustness and board-level density are priorities.

Engineers designing systems that demand reliable, high-density programmable logic—particularly in aerospace, defense, or other temperature-challenging environments—will find the APA1000-LG624B delivers a combination of logic capacity, memory, and I/O integration backed by Microchip Technology.

Request a quote or contact sales to discuss availability, lead times, and pricing for APA1000-LG624B.