APA1000-LG624M
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 440 202752 624-BCLGA |
|---|---|
| Quantity | 1,592 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 60 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 624-CLGA (32.5x32.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 624-BCLGA | Number of I/O | 440 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 202752 |
Overview of APA1000-LG624M – ProASICPLUS FPGA, 440 I/O, Military Grade
The APA1000-LG624M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for applications that require high logic density and extended environmental capability. This surface-mount device combines a large number of logic elements, substantial embedded RAM, and a high I/O count in a compact 624-BCLGA package.
With MIL-STD-883 qualification and an operating range from -55 °C to 125 °C, the device targets designs where military-grade qualification and wide temperature operation are required while providing significant on-chip resources for complex digital functions.
Key Features
- Logic Capacity — 56,320 logic elements provide substantial programmable logic resources for implementing complex digital designs.
- On‑Chip Memory — Approximately 0.20 Mbits (202,752 bits) of embedded RAM for buffering, state storage, and data manipulation within the fabric.
- Gate Count — 1,000,000 gates to support dense logic implementations and custom digital functions.
- I/O Density — 440 I/O pins to support multiple peripherals, high-channel-count interfacing, and parallel bus implementations.
- Package and Mounting — 624-BCLGA (supplier device package: 624-CLGA, 32.5 × 32.5 mm) in a surface-mount form factor for compact board integration.
- Power — Operates from a 2.3 V to 2.7 V supply range to match system power rails.
- Environmental and Qualification — Military grade with MIL-STD-883 qualification and RoHS compliance; rated for operation from -55 °C to 125 °C.
Typical Applications
- Military systems — Suitable for designs requiring MIL-STD-883 qualification and extended-temperature operation.
- High-density I/O concentrators — Ideal where large numbers of external interfaces must be routed and managed from a single FPGA.
- Complex digital control and processing — Used for custom logic, protocol handling, and control functions leveraging the device’s logic capacity and on-chip memory.
Unique Advantages
- High logic density: 56,320 logic elements enable implementation of sizeable custom digital functions without external logic expansion.
- Substantial embedded memory: Approximately 0.20 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
- Large I/O availability: 440 I/O pins allow high-channel-count interfacing and flexible system connectivity.
- Military-grade qualification: MIL-STD-883 qualification and a -55 °C to 125 °C operating range support deployment in demanding environments.
- Compact BCLGA package: 624-BCLGA (32.5 × 32.5 mm) surface-mount package balances high pin count with a space-conscious footprint.
- Controlled supply range: 2.3 V to 2.7 V operation aligns with common system power rails for straightforward integration.
Why Choose APA1000-LG624M?
The APA1000-LG624M combines significant programmable logic, embedded memory, and a high I/O count in a military‑qualified package from Microchip Technology. Its combination of resources and qualification makes it suitable for designers building mission-focused systems that require robust operation across extreme temperatures.
This device is suited for customers who need a high-density, qualified FPGA platform that simplifies board-level integration through a compact BCLGA package while offering ample on-chip resources for complex digital designs.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the APA1000-LG624M.

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