APA1000-FGG896A

IC FPGA 642 I/O 896FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA

Quantity 746 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case896-BGANumber of I/O642Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56320Number of Logic Elements/Cells56320
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits202752

Overview of APA1000-FGG896A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA

The APA1000-FGG896A is a ProASICPLUS field-programmable gate array from Microchip Technology, delivered in a 896-BGA surface-mount package. It combines a high count of logic elements and I/O with on-chip embedded memory to address complex, high-density programmable logic needs.

Designed with automotive-grade qualification (AEC-Q100) and a wide operating temperature range, this device targets applications that require robust operation, large I/O capacity and tight power-supply specifications.

Key Features

  • Core Logic  56,320 logic elements providing a total of 1,000,000 gates for complex programmable logic implementations.
  • Embedded Memory  Approximately 202,752 bits (~0.193 Mbits) of on-chip RAM to support buffering, lookup tables and temporary data storage.
  • I/O Density  642 available I/O pins to interface with high-channel-count systems and parallel buses.
  • Power Supply  Operates from a defined supply range of 2.375 V to 2.625 V for predictable power delivery and system integration.
  • Package & Mounting  896-BGA package (supplier device package: 896-FBGA, 31 × 31) with surface-mount mounting type to support compact PCB layouts.
  • Automotive Qualification & Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding thermal environments.
  • Compliance  RoHS compliant, meeting common environmental and material requirements.

Typical Applications

  • Automotive control systems  High I/O count and AEC-Q100 qualification suit in-vehicle control units, sensor aggregation and signal processing tasks.
  • High-density I/O interfaces  Large I/O complement enables bridging, protocol conversion and parallel-data handling in communications and embedded controllers.
  • Embedded logic and signal processing  Extensive logic resources and on-chip RAM support custom datapaths, state machines and data buffering for embedded systems.

Unique Advantages

  • Automotive-grade qualification: AEC-Q100 qualification and automotive grade designation provide confidence for vehicle electronics applications.
  • High logic capacity: 56,320 logic elements and 1,000,000 gates allow designers to implement large, complex logic functions on a single device.
  • Massive I/O connectivity: 642 I/O pins reduce the need for external multiplexing or expanders in high-channel-count designs.
  • Compact, robust packaging: 896-FBGA (31 × 31) surface-mount package enables dense PCB layouts while supporting reliable solder attach and thermal performance.
  • Wide operating range: −40 °C to 125 °C operation combined with a tightly specified supply range (2.375 V–2.625 V) supports reliable performance in challenging environments.
  • Regulatory material compliance: RoHS compliance simplifies environmental qualification and procurement for global deployments.

Why Choose APA1000-FGG896A?

The APA1000-FGG896A positions itself as a high-capacity, automotive-qualified FPGA option for designs that require large programmable logic, significant I/O bandwidth and dependable environmental performance. Its combination of 56,320 logic elements, extensive I/O and on-chip memory makes it suitable for complex embedded logic, interface consolidation and vehicle electronics systems.

Backed by Microchip Technology and provided in a compact 896-BGA package, this device offers designers a scalable, robust building block for long-life designs where qualification, connectivity and thermal tolerance matter.

Request a quote or submit a purchase inquiry to get pricing and availability for the APA1000-FGG896A. Our team can assist with lead times and ordering details.

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