APA1000-FGG896A
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA |
|---|---|
| Quantity | 746 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 642 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 202752 |
Overview of APA1000-FGG896A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 642 202752 896-BGA
The APA1000-FGG896A is a ProASICPLUS field-programmable gate array from Microchip Technology, delivered in a 896-BGA surface-mount package. It combines a high count of logic elements and I/O with on-chip embedded memory to address complex, high-density programmable logic needs.
Designed with automotive-grade qualification (AEC-Q100) and a wide operating temperature range, this device targets applications that require robust operation, large I/O capacity and tight power-supply specifications.
Key Features
- Core Logic 56,320 logic elements providing a total of 1,000,000 gates for complex programmable logic implementations.
- Embedded Memory Approximately 202,752 bits (~0.193 Mbits) of on-chip RAM to support buffering, lookup tables and temporary data storage.
- I/O Density 642 available I/O pins to interface with high-channel-count systems and parallel buses.
- Power Supply Operates from a defined supply range of 2.375 V to 2.625 V for predictable power delivery and system integration.
- Package & Mounting 896-BGA package (supplier device package: 896-FBGA, 31 × 31) with surface-mount mounting type to support compact PCB layouts.
- Automotive Qualification & Temperature Range Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding thermal environments.
- Compliance RoHS compliant, meeting common environmental and material requirements.
Typical Applications
- Automotive control systems High I/O count and AEC-Q100 qualification suit in-vehicle control units, sensor aggregation and signal processing tasks.
- High-density I/O interfaces Large I/O complement enables bridging, protocol conversion and parallel-data handling in communications and embedded controllers.
- Embedded logic and signal processing Extensive logic resources and on-chip RAM support custom datapaths, state machines and data buffering for embedded systems.
Unique Advantages
- Automotive-grade qualification: AEC-Q100 qualification and automotive grade designation provide confidence for vehicle electronics applications.
- High logic capacity: 56,320 logic elements and 1,000,000 gates allow designers to implement large, complex logic functions on a single device.
- Massive I/O connectivity: 642 I/O pins reduce the need for external multiplexing or expanders in high-channel-count designs.
- Compact, robust packaging: 896-FBGA (31 × 31) surface-mount package enables dense PCB layouts while supporting reliable solder attach and thermal performance.
- Wide operating range: −40 °C to 125 °C operation combined with a tightly specified supply range (2.375 V–2.625 V) supports reliable performance in challenging environments.
- Regulatory material compliance: RoHS compliance simplifies environmental qualification and procurement for global deployments.
Why Choose APA1000-FGG896A?
The APA1000-FGG896A positions itself as a high-capacity, automotive-qualified FPGA option for designs that require large programmable logic, significant I/O bandwidth and dependable environmental performance. Its combination of 56,320 logic elements, extensive I/O and on-chip memory makes it suitable for complex embedded logic, interface consolidation and vehicle electronics systems.
Backed by Microchip Technology and provided in a compact 896-BGA package, this device offers designers a scalable, robust building block for long-life designs where qualification, connectivity and thermal tolerance matter.
Request a quote or submit a purchase inquiry to get pricing and availability for the APA1000-FGG896A. Our team can assist with lead times and ordering details.

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