APA1000-FG1152I

The APA1000-FG1152I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density programmable fabric with 56,320 logic elements, approximately 0.203 Mbits of embedded memory, and 712 general-purpose I/O pins in a 1152-BGA package.

Targeted at industrial applications, this device combines substantial logic capacity, a large I/O count and a compact 1152-FPBGA (35×35) package for systems requiring high integration within a defined temperature and voltage range.

Key Features

• Logic Capacity — 56,320 logic elements and an estimated 1,000,000 gates provide substantial programmable logic for complex designs.
• Embedded Memory — Approximately 0.203 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density — 712 I/O pins suitable for high-pin-count systems, extensive peripheral interfacing and multi-channel connectivity.
• Package & Mounting — 1152-BGA package (supplier device package: 1152-FPBGA (35×35)) with surface-mount mounting for compact board-level integration.
• Power — Operates from a 2.3 V to 2.7 V supply range to match targeted system power domains.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 85 °C for use in temperature-demanding environments.
• Compliance — RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Industrial Control and Automation — High logic density and industrial temperature rating enable complex control algorithms, sensor aggregation and real-time interfacing in factory and process environments.
• Communications and Networking — Large I/O count supports dense peripheral connections and multi-channel I/O required for network interface and data-routing functions.
• Instrumentation and Test Equipment — On-chip memory and extensive logic resources support data acquisition, pre-processing and custom signal handling in bench and field instruments.

Unique Advantages

• High integration density: 56,320 logic elements and ~1,000,000 gates reduce the need for external glue logic and simplify system architecture.
• Extensive I/O capability: 712 I/O pins enable direct connection to numerous peripherals, sensors and interfaces, lowering board-level complexity.
• Industrial temperature tolerance: Rated −40 °C to 85 °C to meet the environmental demands of industrial deployments.
• Compact BGA footprint: 1152-FPBGA (35×35) package allows for a smaller PCB footprint while maintaining high pin density.
• Controlled supply range: 2.3 V to 2.7 V operation aligns with common system power rails for straightforward integration.
• RoHS compliant: Meets environmental compliance requirements for production and deployment.

Why Choose APA1000-FG1152I?

The APA1000-FG1152I delivers a balance of logic capacity, I/O density and industrial operating range suited to systems that require significant programmable logic within a compact package. Its combination of 56,320 logic elements, extensive I/O and embedded memory makes it well suited for designers building industrial control, communications, and instrumentation solutions that demand on-board processing and flexible interfacing.

With a defined supply range and RoHS compliance, the APA1000-FG1152I is positioned for long-term deployment in temperature-challenging environments where board-level integration and reliable operation are priorities.

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