APA1000-BGG456

The APA1000-BGG456 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a large logic fabric and significant I/O count in a compact surface-mount BBGA package for commercial-temperature applications.

Designed to implement custom digital logic, the device combines a high number of logic elements and gates with on-chip RAM and extensive I/O to support complex, board-level designs that operate from a 2.3 V to 2.7 V supply.

Key Features

• Logic Capacity — 56,320 logic elements and 1,000,000 gates provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 0.20 Mbits of embedded memory (202,752 bits) to support state machines, buffering and small-data storage requirements.
• I/O Density — 356 user I/O pins to accommodate multiple interfaces and parallel connections without external expansion.
• Power — Operates from a 2.3 V to 2.7 V supply range, allowing integration into designs with tight voltage constraints.
• Package and Mounting — 456-BBGA package, supplier device package 456-PBGA (35×35), offered as a surface-mount device for space-efficient board layouts.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 70 °C.
• Compliance — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Custom Digital Logic — Implement application-specific finite state machines and logic functions using 56,320 logic elements and 1,000,000 gates.
• High-Density I/O Systems — Leverage 356 I/O pins for multi-channel interfaces, parallel peripherals, and complex board-level connectivity.
• Embedded Control and Buffering — Use approximately 0.20 Mbits of embedded memory for small buffers, lookup tables, and control-state storage.
• Compact, Surface-Mount Designs — 456-BBGA (35×35) packaging enables high-density PCB layouts where board space is constrained.

Unique Advantages

• High logic density: Large logic element and gate counts enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Extensive I/O count: 356 I/Os reduce the need for external I/O expanders and simplify interfacing to numerous peripherals or parallel buses.
• Integrated on-chip memory: Approximately 0.20 Mbits of embedded memory supports local buffering and state storage without external RAM.
• Compact surface-mount package: 456-BBGA (456-PBGA, 35×35) balances high pin count with a package footprint suitable for dense PCB designs.
• Commercial temperature rating: Rated for 0 °C to 70 °C operation to meet standard commercial product requirements.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose APA1000-BGG456?

The APA1000-BGG456 brings together a substantial programmable logic resource set, on-chip memory, and a very high I/O count in a compact surface-mount BBGA package. These attributes make it well suited to designs that require dense logic integration and extensive external connectivity within commercial temperature limits and a 2.3 V to 2.7 V power envelope.

As a Microchip Technology ProASICPLUS device, the APA1000-BGG456 is positioned for designers seeking a scalable, high-density FPGA solution that simplifies board-level integration while meeting RoHS environmental requirements.

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