APA1000-BG456I
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA |
|---|---|
| Quantity | 270 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 456-PBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 356 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56320 | Number of Logic Elements/Cells | 56320 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 202752 |
Overview of APA1000-BG456I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA
The APA1000-BG456I is a ProASICPLUS Field Programmable Gate Array (FPGA) offering a dense logic fabric and extensive I/O for industrial embedded designs. It provides 56,320 logic elements, approximately 1,000,000 gates and 202,752 bits of on-chip RAM to implement custom digital logic and buffering.
Packaged in a 456-ball BGA (456-PBGA, 35×35) and rated for industrial operation, the device supports a 2.3 V to 2.7 V supply range and an operating temperature range of -40°C to 85°C, making it suitable for ruggedized or controlled industrial environments that require high I/O count and on-chip memory.
Key Features
- Core Logic 56,320 logic elements providing the programmable resources needed for complex digital functions, with approximately 1,000,000 gates of logic capacity.
- Embedded Memory 202,752 bits of total on-chip RAM for data buffering, state storage, and small embedded memories.
- I/O Density 356 general-purpose I/O pins to support wide interface counts, parallel I/O, and multiple external peripherals.
- Power Supply Operates from a 2.3 V to 2.7 V supply range, enabling integration into designs with narrow core-voltage domains.
- Package & Mounting 456-ball BGA package (456-PBGA, 35×35) optimized for surface-mount assembly and high-pin-count board layouts.
- Industrial Temperature Grade Rated for operation from -40°C to 85°C, aligning with industrial application requirements.
- RoHS Compliant Meets RoHS environmental requirements for lead-free manufacturing.
Typical Applications
- Industrial Control and Automation — Deploy custom control logic and high-density I/O interfacing in factory automation, PLCs, and motor-control systems where industrial temperature support is required.
- Embedded Processing and I/O Expansion — Implement glue logic, protocol conversion, and parallel data paths using the device's large logic element count and abundant I/O.
- Communications and Networking Hardware — Use the on-chip RAM and high I/O count for buffering, interface bridging, and custom packet handling in communications equipment.
- Test & Measurement Equipment — Integrate custom timing, digital signal routing, and control functions into instrumentation with reliable industrial-grade operation.
Unique Advantages
- High Logic Capacity: 56,320 logic elements and ~1,000,000 gates provide substantial programmable resources for complex designs without external logic.
- Significant On-Chip RAM: 202,752 bits of embedded memory reduce dependence on external RAM for small buffers and state storage.
- Extensive I/O Count: 356 I/O pins enable direct interfacing to multiple peripherals, sensors, and parallel buses, simplifying board-level design.
- Industrial-Grade Operation: -40°C to 85°C temperature rating and surface-mount BGA packaging support deployment in industrial environments.
- Compact, High-Pin-Count Package: 456-ball BGA (35×35) provides high interconnect density for space-constrained boards while supporting numerous signals.
- RoHS Compliance: Environmentally compliant construction fits modern manufacturing requirements.
Why Choose APA1000-BG456I?
The APA1000-BG456I positions itself as a robust programmable solution for industrial embedded systems requiring substantial logic resources, on-chip memory, and large I/O counts. Its combination of 56,320 logic elements, 202,752 bits of RAM, and 356 I/Os provides designers with the flexibility to implement complex control, interfacing, and buffering functions within a single device.
This device is well suited to engineering teams building industrial controls, networking hardware, test equipment, and other applications where durable operation, compact board integration, and a high number of signals are important. The APA1000-BG456I delivers long-term value through integration density, industrial temperature capability, and RoHS compliance.
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