APA1000-BG456I

IC FPGA 356 I/O 456BGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA

Quantity 270 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package456-PBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case456-BBGANumber of I/O356Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56320Number of Logic Elements/Cells56320
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits202752

Overview of APA1000-BG456I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 356 202752 456-BBGA

The APA1000-BG456I is a ProASICPLUS Field Programmable Gate Array (FPGA) offering a dense logic fabric and extensive I/O for industrial embedded designs. It provides 56,320 logic elements, approximately 1,000,000 gates and 202,752 bits of on-chip RAM to implement custom digital logic and buffering.

Packaged in a 456-ball BGA (456-PBGA, 35×35) and rated for industrial operation, the device supports a 2.3 V to 2.7 V supply range and an operating temperature range of -40°C to 85°C, making it suitable for ruggedized or controlled industrial environments that require high I/O count and on-chip memory.

Key Features

  • Core Logic 56,320 logic elements providing the programmable resources needed for complex digital functions, with approximately 1,000,000 gates of logic capacity.
  • Embedded Memory 202,752 bits of total on-chip RAM for data buffering, state storage, and small embedded memories.
  • I/O Density 356 general-purpose I/O pins to support wide interface counts, parallel I/O, and multiple external peripherals.
  • Power Supply Operates from a 2.3 V to 2.7 V supply range, enabling integration into designs with narrow core-voltage domains.
  • Package & Mounting 456-ball BGA package (456-PBGA, 35×35) optimized for surface-mount assembly and high-pin-count board layouts.
  • Industrial Temperature Grade Rated for operation from -40°C to 85°C, aligning with industrial application requirements.
  • RoHS Compliant Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

  • Industrial Control and Automation — Deploy custom control logic and high-density I/O interfacing in factory automation, PLCs, and motor-control systems where industrial temperature support is required.
  • Embedded Processing and I/O Expansion — Implement glue logic, protocol conversion, and parallel data paths using the device's large logic element count and abundant I/O.
  • Communications and Networking Hardware — Use the on-chip RAM and high I/O count for buffering, interface bridging, and custom packet handling in communications equipment.
  • Test & Measurement Equipment — Integrate custom timing, digital signal routing, and control functions into instrumentation with reliable industrial-grade operation.

Unique Advantages

  • High Logic Capacity: 56,320 logic elements and ~1,000,000 gates provide substantial programmable resources for complex designs without external logic.
  • Significant On-Chip RAM: 202,752 bits of embedded memory reduce dependence on external RAM for small buffers and state storage.
  • Extensive I/O Count: 356 I/O pins enable direct interfacing to multiple peripherals, sensors, and parallel buses, simplifying board-level design.
  • Industrial-Grade Operation: -40°C to 85°C temperature rating and surface-mount BGA packaging support deployment in industrial environments.
  • Compact, High-Pin-Count Package: 456-ball BGA (35×35) provides high interconnect density for space-constrained boards while supporting numerous signals.
  • RoHS Compliance: Environmentally compliant construction fits modern manufacturing requirements.

Why Choose APA1000-BG456I?

The APA1000-BG456I positions itself as a robust programmable solution for industrial embedded systems requiring substantial logic resources, on-chip memory, and large I/O counts. Its combination of 56,320 logic elements, 202,752 bits of RAM, and 356 I/Os provides designers with the flexibility to implement complex control, interfacing, and buffering functions within a single device.

This device is well suited to engineering teams building industrial controls, networking hardware, test equipment, and other applications where durable operation, compact board integration, and a high number of signals are important. The APA1000-BG456I delivers long-term value through integration density, industrial temperature capability, and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the APA1000-BG456I.

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