APA1000-PQG208A

The APA1000-PQG208A is a ProASICPLUS Field Programmable Gate Array (FPGA) IC supplied in a 208-BFQFP surface-mount package. It provides a high logic-capacity FPGA fabric with on-chip RAM and substantial I/O count for embedded and automotive applications.

Designed and qualified for automotive use, the device combines 56,320 logic elements and approximately 1,000,000 gates with AEC-Q100 qualification and an extended operating range, delivering a platform suited to vehicle electronics and other temperature-demanding embedded designs.

Key Features

• Core Logic — 56,320 logic elements enabling complex custom logic implementations across a large fabric.
• Gate Count — Approximately 1,000,000 gates to support sizable designs and integration of multiple functions on-chip.
• Embedded Memory — Approximately 0.20 Mbits of on-chip RAM (202,752 total RAM bits) for buffering and local data storage.
• I/O Capacity — 158 I/O pins to interface with sensors, controllers, and peripheral devices.
• Supply Voltage — Operates from 2.375 V to 2.625 V for core supply compatibility with targeted system designs.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification for deployment in automotive electronic systems.
• Temperature Range — Rated for operation from −40°C to 125°C to meet extended-temperature application needs.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Automotive Control Modules — AEC-Q100 qualification and −40°C to 125°C operating range make the APA1000-PQG208A suitable for implementation in vehicle electronic control units and body electronics.
• Powertrain and Motor Control — High logic capacity and on-chip RAM support development of custom control logic and buffering for motor drive and powertrain subsystems.
• Sensor Aggregation and Signal Conditioning — 158 I/O pins enable aggregation and pre-processing of multiple sensor inputs in embedded systems.
• Vehicle Gateway and Interface Devices — Dense I/O and programmable logic allow flexible interfacing between subsystems and custom protocol handling in automotive environments.

Unique Advantages

• High integration density: 56,320 logic elements and ~1,000,000 gates reduce the need for multiple discrete devices by consolidating logic on a single FPGA.
• On-chip memory: Approximately 0.20 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Automotive-ready qualification: AEC-Q100 grading provides a verified qualification pathway for in-vehicle deployments.
• Extended temperature support: −40°C to 125°C rating matches the thermal requirements of harsh operating environments.
• Ample I/O for system integration: 158 I/O pins enable broad connectivity for sensors, actuators, and communication interfaces.
• PCB-friendly package: 208-BFQFP (28×28) surface-mount package simplifies board-level assembly and integration.

Why Choose APA1000-PQG208A?

The APA1000-PQG208A positions itself as a high-capacity, automotive-qualified FPGA option for designs that require substantial logic resources, embedded memory, and a large number of I/O in a compact surface-mount package. Its AEC-Q100 qualification and −40°C to 125°C operating range make it suitable for vehicle electronics and other embedded applications where extended temperature operation and qualification are required.

Engineers selecting the APA1000-PQG208A gain a programmable platform that consolidates multiple functions on-chip—reducing component count and simplifying board-level integration while meeting automotive qualification criteria.

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