APA150-FG144A

The APA150-FG144A is a ProASICPLUS field programmable gate array offering 6,144 logic elements, 36,864 bits of on-chip RAM, and 100 I/O in a compact 144‑LBGA package. Designed for applications that require a qualified, robust programmable logic device, it combines measurable logic capacity, embedded memory, and a defined supply and thermal envelope for dependable operation.

This device is AEC‑Q100 qualified with a specified operating temperature range of −40 °C to 125 °C, a supply range of 2.375 V to 2.625 V, and a surface-mount 144‑FPBGA (13×13) package, making it suitable for designs that require qualification-grade components and a compact form factor.

Key Features

• Logic Capacity — 6,144 logic elements (equivalent to the device's available logic resources) and approximately 150,000 gates to implement custom digital functions and glue logic.
• Embedded Memory — 36,864 total RAM bits (approximately 0.0369 Mbits) for on-chip buffering, state storage, and small lookup tables.
• I/O — 100 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package and Mounting — 144‑LBGA package (supplier device package: 144‑FPBGA 13×13) with surface-mount mounting for compact PCB layouts.
• Power — Defined supply voltage range of 2.375 V to 2.625 V for predictable power budgeting and integration.
• Qualification and Reliability — AEC‑Q100 qualification and extended operating temperature from −40 °C to 125 °C for use in temperature-demanding environments.
• Compliance — RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Automotive control modules — AEC‑Q100 qualification and the −40 °C to 125 °C operating range support in-vehicle electronics that require qualified components and wide temperature tolerance.
• Embedded control and I/O bridging — 100 I/O and 6,144 logic elements provide flexibility for interface logic, protocol adaptation, and glue-logic tasks in compact embedded systems.
• Space-constrained designs — The 144‑LBGA (13×13) surface-mount package enables high-density PCB layouts where board area is limited.

Unique Advantages

• Qualification-ready for demanding environments — AEC‑Q100 qualification and extended temperature rating help reduce validation scope for applications targeting qualified deployments.
• Balanced logic and memory — 6,144 logic elements paired with 36,864 bits of embedded RAM provide a blend of programmable logic and local storage for control and data-path functions.
• Defined low-voltage operation — Narrow supply range (2.375 V–2.625 V) simplifies power-supply selection and helps ensure predictable device behavior.
• Compact package — 144‑LBGA (144‑FPBGA 13×13) surface-mount package supports compact, high-density board designs while maintaining a sizable I/O count.
• Environmental compliance — RoHS compliance for regulatory adherence and streamlined manufacturing processes.

Why Choose APA150-FG144A?

The APA150-FG144A positions itself as a qualified, compact FPGA option for designs that require a measurable amount of programmable logic, on-chip RAM, and a solid I/O complement in a space-efficient package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it suitable where component qualification and extended thermal tolerance are important design considerations.

This device is well suited to engineers and procurement teams seeking a reliable, RoHS‑compliant FPGA with defined supply and thermal specifications, a clear logic and memory footprint, and a compact LBGA package for integration into constrained boards and qualified systems.

Request a quote or submit a parts inquiry to receive pricing, lead time, and availability for APA150-FG144A. Our team will provide the information you need to evaluate this device for your design.