APA150-FG256A
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA |
|---|---|
| Quantity | 559 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 150000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 36864 |
Overview of APA150-FG256A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA
The APA150-FG256A is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range logic capacity with 6,144 logic elements and approximately 36.9 kbits of embedded RAM in a compact 256-LBGA package.
Designed for embedded and automotive-aware applications, the device combines a 186-pin I/O count, AEC-Q100 qualification, and a wide operating temperature range to support reliable operation across demanding environments.
Key Features
- Core Logic 6,144 logic elements (equivalent to 150,000 gates) for programmable digital logic and glue-logic functions.
- Embedded Memory Approximately 36.9 kbits of on-chip RAM for local data buffering and state storage.
- I/O Density 186 general-purpose I/Os to support multiple interfaces and peripheral connections within a single device.
- Power Voltage supply range of 2.375 V to 2.625 V to match target system power rails.
- Package and Mounting 256-LBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
- Automotive Qualification and Temperature Range AEC-Q100 qualification with operation from −40 °C to 125 °C for designs requiring automotive-grade qualification and broad temperature tolerance.
- Environmental Compliance RoHS-compliant material status for regulatory and manufacturing considerations.
Typical Applications
- Automotive Control Systems Suitable for control, interface, and sensor aggregation functions in automotive systems where AEC-Q100 qualification and wide temperature range are required.
- Embedded Control and Signal Glue Logic Use as programmable glue logic or custom control functions in embedded platforms leveraging its logic capacity and on-chip RAM.
- Industrial Automation High I/O count and robust temperature rating enable deployment in industrial control and monitoring equipment.
- Interface Bridging and Peripheral Expansion 186 I/Os allow consolidation of multiple interfaces or expansion of existing microcontroller/peripheral connectivity.
Unique Advantages
- Automotive-Qualified Device: AEC-Q100 qualification provides a clear path for automotive applications requiring recognized component qualification.
- Balanced Logic and Memory: 6,144 logic elements combined with approximately 36.9 kbits of embedded RAM supports a wide range of control and buffering tasks without external memory.
- High I/O Count: 186 I/Os reduce the need for additional interface components and simplify board routing for multi-peripheral systems.
- Compact, Surface-Mount Package: 256-LBGA (17 × 17 mm) enables space-efficient PCB layouts while providing robust soldered connections for production assembly.
- Wide Operating Range: Operation from −40 °C to 125 °C accommodates harsh thermal environments common in automotive and industrial applications.
- Regulatory Compliance: RoHS status supports environmental and manufacturing requirements.
Why Choose APA150-FG256A?
The APA150-FG256A is positioned for designers seeking a mid-range, automotive-aware FPGA with a balanced mix of logic, memory, and I/O in a compact package. Its AEC-Q100 qualification and wide temperature capability make it suitable for applications that demand robustness and reliability.
This device is well suited for embedded and automotive projects that require programmable logic, local memory, and a high I/O count while maintaining a small board footprint and compliance with environmental standards.
Request a quote or submit an inquiry to receive pricing and availability information for the APA150-FG256A.

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