APA150-FG256

The APA150-FG256 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for medium-density programmable logic tasks. It provides a balance of logic capacity, embedded memory, and I/O count in a compact 256-LBGA package for commercial-grade applications.

With 6,144 logic elements and approximately 36.9 Kbits of on-chip RAM, this device is suited to designs that require significant gate-equivalent logic, numerous external connections, and low-voltage operation within a 0 °C to 70 °C operating range.

Key Features

• Logic Capacity — 6,144 logic elements (equivalent) and approximately 150,000 gates provide medium-density programmable logic for custom digital designs.
• Embedded Memory — Total on-chip RAM of 36,864 bits (approximately 36.9 Kbits) for storage of state, small buffers, or lookup tables.
• I/O Resources — Up to 186 user I/O pins to support a wide range of external interfaces and peripherals.
• Supply Voltage — Operates from 2.3 V to 2.7 V to meet low-voltage system requirements.
• Package and Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) for compact PCB integration.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for typical commercial deployments.
• RoHS Compliant — Manufactured in accordance with RoHS requirements.

Typical Applications

• General-purpose programmable logic — Implement custom combinational and sequential logic using 6,144 logic elements and up to 150,000 gates.
• I/O-intensive control — Designs requiring many external connections can leverage the device’s 186 I/O pins for sensors, interfaces, and peripheral control.
• Compact system integration — The 256-LBGA surface-mount package supports space-constrained PCB layouts where a medium-density FPGA is required.

Unique Advantages

• Balanced logic and memory — 6,144 logic elements combined with approximately 36.9 Kbits of RAM provide a useful mix of logic resources and embedded memory for a range of digital functions.
• High I/O count — 186 I/Os allow direct interfacing to multiple peripherals and bus connections without extensive external glue logic.
• Compact packaging — 256-LBGA (17 × 17 mm) enables dense PCB placement while maintaining robust solder mounting.
• Low-voltage operation — 2.3 V to 2.7 V supply range supports integration into low-voltage systems.
• Commercial-grade suitability — Rated for operation from 0 °C to 70 °C to meet standard commercial environment requirements.
• Regulatory compliance — RoHS-compliant manufacturing minimizes environmental and regulatory concerns.

Why Choose APA150-FG256?

The APA150-FG256 delivers a practical combination of medium-density logic, on-chip memory, and a high I/O count in a compact LBGA package, making it a solid choice for commercial embedded designs that require flexible programmable logic and numerous external interfaces. Its low-voltage operation and RoHS compliance support modern system requirements while the 0 °C to 70 °C rating aligns with typical commercial deployments.

This device is well suited to engineers and procurement teams targeting scalable, space-efficient FPGA integration for control, interface, and custom-logic functions where the listed specifications meet design requirements.

Request a quote or submit a sales inquiry to obtain pricing, availability, and lead-time information for APA150-FG256.