APA150-FGG144

The APA150-FGG144 is a ProASICPLUS field programmable gate array (FPGA) in a 144-LBGA package designed for commercial embedded applications. It provides a mid-range logic density with 6,144 logic elements, 100 user I/Os and on-chip RAM suitable for control, interface and glue-logic functions where compact packaging and RoHS compliance are required.

Key Features

• Logic Capacity  6,144 logic elements delivering approximately 150,000 equivalent gates for medium-density logic integration.
• Embedded Memory  Total on-chip RAM of 36,864 bits to support small data buffers, state machines and local storage.
• I/O  100 user I/Os to interface with peripherals, sensors and external devices in compact designs.
• Power  Operates from a 2.3 V to 2.7 V supply range to match common low-voltage system rails.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for space-constrained PCBs.
• Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 70 °C, suitable for standard indoor and consumer environments.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Typical Applications

• Embedded Control  Implement finite-state machines, protocol handlers or control logic for appliances and consumer electronics using available logic elements and I/Os.
• Interface Bridging  Bridge between peripherals and processors, using 100 I/Os to manage multiple signal lines and small FIFO or buffering with on-chip RAM.
• Prototyping and Evaluation  Rapidly prototype mid-density digital functions where a compact LBGA package and commercial temperature range are appropriate.
• User Interface Control  Drive button matrices, LEDs and display interfaces while handling local logic and timing requirements on-chip.

Unique Advantages

• Balanced Logic and Memory  6,144 logic elements paired with 36,864 bits of RAM provide a practical balance for mid-range digital designs without external memory.
• Generous I/O Count  100 I/Os enable multi-channel interfacing and flexible board-level partitioning, reducing the need for additional I/O expanders.
• Compact Surface-Mount Package  144-LBGA (13×13) allows high-density placement on space-constrained PCBs while maintaining robust solder mounting.
• Low-Voltage Operation  2.3 V to 2.7 V supply compatibility aligns with common low-voltage system rails used in modern embedded designs.
• RoHS Compliant  Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose APA150-FGG144?

The APA150-FGG144 is positioned for engineers and procurement teams seeking a mid-density FPGA solution with a clear balance of logic capacity, I/O resources and on-chip RAM in a compact 144-LBGA package. Its commercial-grade temperature range and RoHS compliance make it suitable for consumer and general-purpose embedded systems that require reliable logic integration without external memory.

This device is appropriate for designs that need moderate gate counts and flexible interfacing while keeping board space and BOM complexity under control. Its specifications make it a practical choice for product development and production where the listed voltage, temperature and packaging characteristics match system requirements.

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