APA150-FGG256A

The APA150-FGG256A is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology. It provides a mix of programmable logic, I/O density and on-chip RAM in a compact 256-LBGA package suitable for embedded and automotive electronic designs.

Key attributes include 6,144 logic elements, approximately 36.9 kbits of embedded memory, 186 I/O pins and a 2.375 V to 2.625 V supply range, and the device is AEC-Q100 qualified for automotive use with an operating range of -40 °C to 125 °C.

Key Features

• Logic Capacity — 6,144 logic elements (cells) delivering a total of 150,000 gates for implementing custom digital logic and control functions.
• On-Chip Memory — Approximately 36.9 kbits (36,864 bits) of embedded RAM for small buffers, state storage, and tightly coupled data paths.
• I/O Density — 186 user I/O pins to support multiple peripheral connections and signal interfaces within a single device.
• Power Supply — Supported core supply voltage range of 2.375 V to 2.625 V to match system power domains and streamline power sequencing.
• Package & Mounting — 256-LBGA package (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for high-density PCB layouts.
• Automotive Qualification & Temperature Range — AEC-Q100 qualification and operating temperature range of -40 °C to 125 °C for deployment in automotive electronics.
• Regulatory Compliance — RoHS compliant to meet environmental and manufacturing lead-free requirements.

Typical Applications

• Automotive electronic control units (ECUs) — Implements custom logic, signal aggregation and control functions where AEC-Q100 qualification and extended temperature range are required.
• In-vehicle sensor interfaces — Aggregates and conditions signals from multiple sensors using available I/O and embedded memory for buffering.
• Embedded control and signal processing — Provides programmable logic and on-chip RAM for control loops, state machines and deterministic logic tasks in compact packages.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 qualification and an operating range of -40 °C to 125 °C enable use in temperature-demanding automotive environments.
• Balanced integration: Combines 6,144 logic elements, approximately 36.9 kbits of RAM and 186 I/Os to reduce external components and simplify board-level design.
• Compact BGA footprint: 256-LBGA (256-FPBGA 17×17) provides high pin count in a space-efficient surface-mount package for dense PCB layouts.
• Tightly specified supply window: 2.375 V to 2.625 V supply range supports stable core operation and straightforward power planning.
• RoHS compliant: Conforms to lead-free manufacturing processes for environmental and production compatibility.

Why Choose APA150-FGG256A?

The APA150-FGG256A is positioned for embedded and automotive designs that require a qualified programmable logic device with a compact BGA footprint, substantial I/O, and a defined on-chip memory resource. Its combination of 6,144 logic elements, approximately 36.9 kbits of RAM and 186 I/Os provides a balanced integration that can reduce BOM count and PCB complexity.

Manufactured by Microchip Technology and AEC-Q100 qualified, this device is suitable for engineers designing automotive electronic systems that demand defined operating conditions, RoHS compliance, and a surface-mount, high-pin-count package for dense board implementations.

Request a quote or submit a product inquiry to obtain pricing, availability and lead-time information for the APA150-FGG256A.