APA150-FGG256I

The APA150-FGG256I is a ProASICPLUS field programmable gate array (FPGA) IC offering 150,000 gates, 6,144 logic elements, and 36,864 bits of on-chip RAM. Designed as an industrial-grade, surface-mount device, it provides a balanced combination of logic density, I/O capacity and embedded memory for mid-density programmable logic designs.

Its electrical and environmental specifications—2.3 V to 2.7 V supply range and an operating temperature of -40 °C to 85 °C—make it suitable for applications that require reliable operation across standard industrial temperature conditions while maintaining a compact 256-LBGA package footprint.

Key Features

• Core Logic 150,000 gates and 6,144 logic elements deliver mid-range programmable logic capacity for custom logic implementation and glue-logic tasks.
• Embedded Memory 36,864 bits of on-chip RAM provide local storage for state machines, buffering and small lookup tables.
• I/O Capacity 186 general-purpose I/Os support broad peripheral and bus interfacing requirements without additional I/O expanders.
• Power Operates from a 2.3 V to 2.7 V supply range, enabling integration into systems with tightly controlled core rail voltages.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range Rated for operation from -40 °C to 85 °C to meet typical industrial ambient requirements.
• Environmental Compliance RoHS-compliant construction supports lead-free assembly and regulatory requirements for many commercial and industrial products.

Typical Applications

• Industrial Control Systems — Leverage the industrial temperature rating and mid-level logic density to implement custom control logic, protocol bridging, and I/O aggregation.
• Embedded Processing Interfaces — Use the 186 I/Os and on-chip RAM for peripheral interface logic, data buffering and glue logic between processors and external devices.
• Communications & Networking Modules — Implement packet-handling, custom protocol adaptation, or timing/control logic where moderate gate count and plentiful I/O are required.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and 150,000 gates provide sufficient capacity for many mid-range programmable tasks without over-provisioning.
• Generous I/O Count: 186 I/Os reduce the need for external I/O expanders and simplify board-level routing for complex interface requirements.
• Compact, Surface-Mount Packaging: 256-LBGA (256-FPBGA, 17 × 17) enables high-density PCB layouts while maintaining manufacturability with surface-mount processes.
• Industrial-Grade Operation: Rated for -40 °C to 85 °C and RoHS-compliant, supporting deployment in standard industrial environments with regulatory-conformant materials.
• Low-Voltage Core: 2.3 V to 2.7 V supply range helps align the device with systems using reduced-voltage rails.

Why Choose APA150-FGG256I?

The APA150-FGG256I positions itself as a pragmatic, industrial-grade FPGA option for designs requiring moderate logic capacity, substantial I/O, and embedded RAM in a compact surface-mount package. Its electrical and thermal specifications provide predictable behavior in typical industrial ambient conditions while supporting modern low-voltage system architectures.

This device is well suited to engineers and teams building mid-density programmable logic solutions—such as control logic, interface bridging, and protocol handling—who need a reliable, RoHS-compliant FPGA with a clear balance of logic elements, on-chip memory and I/O capability.

Request a quote or submit an inquiry to receive pricing and availability information for the APA150-FGG256I. Our team can provide lead-time details and support to help integrate this FPGA into your next design.