APA150-FGG256

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA

Quantity 1,333 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates150000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of APA150-FGG256 – ProASICPLUS FPGA, 256-LBGA, 186 I/O

The APA150-FGG256 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded logic applications. It delivers 6,144 logic elements, 36,864 bits of on-chip RAM, and up to 186 I/Os in a compact 256-ball LFBGA package, providing a balance of logic capacity and I/O density for system-level integration.

With a nominal supply range of 2.3 V to 2.7 V and a commercial operating temperature range of 0 °C to 70 °C, this surface-mount FPGA is suited for standard commercial designs that require moderate gate counts and embedded memory capacity while remaining RoHS compliant.

Key Features

  • Core Logic  6,144 logic elements (cells) with an overall gate-equivalent count of 150,000 providing programmable combinational and sequential resources.
  • Embedded Memory  36,864 bits of on-chip RAM (approximately 36.9 kbits) for data buffering, state storage, and small lookup tables.
  • I/O Density  186 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
  • Power  Single supply operation across 2.3 V to 2.7 V to match common system rail voltages.
  • Package & Mounting  256-ball LFBGA (Supplier package: 256-FPBGA, 17×17 mm) in a surface-mount form factor for compact, high-density board layouts.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 70 °C operation.
  • Environmental Compliance  RoHS compliant to meet typical environmental and regulatory requirements for commercial electronic products.

Typical Applications

  • Embedded Logic Systems  Implement custom state machines, glue logic, and protocol converters using the device’s 6,144 logic elements and 186 I/Os.
  • Control and Interface Modules  Use the on-chip RAM and abundant I/O to handle buffering, signal conditioning, and peripheral interfacing in control applications.
  • Prototype and Development Platforms  Leverage the surface-mount 256-LBGA package and commercial-grade rating for rapid evaluation and integration into development boards.

Unique Advantages

  • Balanced Logic and Memory:  6,144 logic elements paired with 36,864 bits of RAM provide a mid-range resource set for mixed control and data tasks.
  • High I/O Count:  186 I/Os enable extensive peripheral connections without external GPIO expanders, simplifying board-level design.
  • Compact, Industry-Standard Package:  256-ball LFBGA (17×17 mm supplier package) allows for high-density PCB layouts while maintaining manufacturability as a surface-mount part.
  • Low-Voltage Operation:  2.3 V to 2.7 V supply compatibility supports integration with common low-voltage system rails.
  • Regulatory Compliance:  RoHS compliance reduces risk for commercial product deployment in regions requiring lead-free components.

Why Choose APA150-FGG256?

The APA150-FGG256 targets designers needing a commercial-grade FPGA with mid-level logic resources, moderate embedded memory, and a high I/O count in a compact LFBGA package. Its specifications—6,144 logic elements, 36,864 bits of RAM, 186 I/Os, and a 2.3–2.7 V supply range—make it well suited for embedded logic, control, and interface applications where board space and I/O density matter.

For teams focused on durable, verifiable designs that require RoHS compliance and straightforward integration into surface-mount assemblies, the APA150-FGG256 offers a clear, spec-driven option backed by Microchip Technology’s product family support.

Request a quote or submit an inquiry to begin the procurement process for APA150-FGG256 and evaluate its fit for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up