APA150-FG256I
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA |
|---|---|
| Quantity | 1,680 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 150000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of APA150-FG256I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA
The APA150-FG256I is a ProASICPLUS flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a fixed hardware resource set including 6,144 logic elements, approximately 0.0369 Mbits of embedded memory, and 186 I/O pins in a compact 256-LBGA package.
Designed for industrial-grade operation, the device supports a 2.3 V to 2.7 V supply range, surface-mount deployment, and an operating temperature range of −40 °C to 85 °C, offering a predictable hardware platform for embedded logic implementations.
Key Features
- Logic Capacity 6,144 logic elements (equivalent to 150,000 gates) provide a defined resource set for combinational and sequential logic implementations.
- Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.0369 Mbits) for small buffers, FIFOs, and state storage.
- I/O Count 186 general-purpose I/O pins to support broad interfacing needs without external multiplexing.
- Package 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) for a compact surface-mount footprint.
- Power Operates from a 2.3 V to 2.7 V supply range to match system voltage domains.
- Temperature and Grade Industrial grade device with an operating temperature range of −40 °C to 85 °C for temperature-hardened deployments.
- Compliance RoHS compliant, meeting common environmental requirements for electronic assemblies.
Unique Advantages
- Balanced logic and I/O resources: 6,144 logic elements paired with 186 I/Os enable integration of moderate-complexity digital functions and direct sensor or peripheral interfacing.
- Embedded memory for control and buffering: 36,864 bits of on-chip RAM provide local storage for state machines, small FIFOs, and configuration data without external RAM.
- Industrial temperature range: Rated from −40 °C to 85 °C to support deployment in industrial environments.
- Compact board footprint: 256-LBGA (17 × 17 FPBGA) package supports space-constrained PCB layouts while maintaining high I/O density.
- Low-voltage operation: 2.3 V to 2.7 V supply compatibility facilitates integration into modern low-voltage systems.
- RoHS compliant: Conforms to common environmental standards for electronics manufacturing.
Why Choose APA150-FG256I?
The APA150-FG256I is positioned for designers who need a flash-based FPGA with a well-defined set of resources: 6,144 logic elements, 186 I/Os, and on-chip RAM in a compact 256-LBGA package. Its industrial temperature rating and 2.3 V–2.7 V supply compatibility make it suitable for embedded systems requiring stable operation across temperature extremes.
For teams seeking predictable resource allocation and integration into surface-mount assemblies, the APA150-FG256I offers a practical balance of logic, memory, and I/O in a RoHS-compliant package backed by Microchip Technology.
Request a quote or submit an inquiry to receive pricing and availability information for the APA150-FG256I.

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