APA150-FG256I

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA

Quantity 1,680 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates150000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of APA150-FG256I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 36864 256-LBGA

The APA150-FG256I is a ProASICPLUS flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a fixed hardware resource set including 6,144 logic elements, approximately 0.0369 Mbits of embedded memory, and 186 I/O pins in a compact 256-LBGA package.

Designed for industrial-grade operation, the device supports a 2.3 V to 2.7 V supply range, surface-mount deployment, and an operating temperature range of −40 °C to 85 °C, offering a predictable hardware platform for embedded logic implementations.

Key Features

  • Logic Capacity  6,144 logic elements (equivalent to 150,000 gates) provide a defined resource set for combinational and sequential logic implementations.
  • Embedded Memory  Total on-chip RAM of 36,864 bits (approximately 0.0369 Mbits) for small buffers, FIFOs, and state storage.
  • I/O Count  186 general-purpose I/O pins to support broad interfacing needs without external multiplexing.
  • Package  256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) for a compact surface-mount footprint.
  • Power  Operates from a 2.3 V to 2.7 V supply range to match system voltage domains.
  • Temperature and Grade  Industrial grade device with an operating temperature range of −40 °C to 85 °C for temperature-hardened deployments.
  • Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Unique Advantages

  • Balanced logic and I/O resources: 6,144 logic elements paired with 186 I/Os enable integration of moderate-complexity digital functions and direct sensor or peripheral interfacing.
  • Embedded memory for control and buffering: 36,864 bits of on-chip RAM provide local storage for state machines, small FIFOs, and configuration data without external RAM.
  • Industrial temperature range: Rated from −40 °C to 85 °C to support deployment in industrial environments.
  • Compact board footprint: 256-LBGA (17 × 17 FPBGA) package supports space-constrained PCB layouts while maintaining high I/O density.
  • Low-voltage operation: 2.3 V to 2.7 V supply compatibility facilitates integration into modern low-voltage systems.
  • RoHS compliant: Conforms to common environmental standards for electronics manufacturing.

Why Choose APA150-FG256I?

The APA150-FG256I is positioned for designers who need a flash-based FPGA with a well-defined set of resources: 6,144 logic elements, 186 I/Os, and on-chip RAM in a compact 256-LBGA package. Its industrial temperature rating and 2.3 V–2.7 V supply compatibility make it suitable for embedded systems requiring stable operation across temperature extremes.

For teams seeking predictable resource allocation and integration into surface-mount assemblies, the APA150-FG256I offers a practical balance of logic, memory, and I/O in a RoHS-compliant package backed by Microchip Technology.

Request a quote or submit an inquiry to receive pricing and availability information for the APA150-FG256I.

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