AT40K40AL-1BGC

IC FPGA 289 I/O 352SBGA
Part Description

AT40KAL Field Programmable Gate Array (FPGA) IC 289 18432 2304 352-LBGA

Quantity 42 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-SBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case352-LBGANumber of I/O289Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2304Number of Logic Elements/Cells2304
Number of Gates50000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of AT40K40AL-1BGC – AT40KAL Field Programmable Gate Array (FPGA) IC, 289 I/Os, 18,432-bit RAM, 2,304 logic elements, 352-LBGA

The AT40K40AL-1BGC is an SRAM-based Field Programmable Gate Array (FPGA) designed for high-performance, reconfigurable logic applications. It implements the AT40KAL architecture with distributed on-chip SRAM, on-chip multipliers and support for dynamic partial or full reconfiguration (Cache Logic).

Targeted at systems requiring programmable DSP-style computation, coprocessing and high I/O density, this commercial-grade device offers a balance of logic capacity, embedded memory and flexible I/O in a 352-ball BGA package.

Key Features

  • Core Performance – System speeds up to 100 MHz with array multipliers capable of >50 MHz and internal tri-state capability in each cell for flexible routing and logic implementation.
  • Logic Capacity – 2,304 logic elements (cells) providing up to 50,000 gates of usable logic for mid‑to‑large sized designs.
  • Embedded Memory (FreeRAM) – Distributed, flexible 10 ns SRAM totaling 18,432 bits usable for single/dual-port, synchronous or asynchronous memory functions without consuming logic resources.
  • I/O and Clocking – 289 user I/Os with PCI-compliant capabilities, programmable output drive and up to 8 global clocks plus 4 dedicated PCI clocks for low-skew clock distribution and flexible timing control.
  • Reconfiguration – Cache Logic dynamic partial/full reconfigurability and unlimited re-programmability via serial or parallel modes to support adaptive designs and in-system updates.
  • Package and Supply – 352-LBGA / 352-SBGA (35×35) package; voltage supply 3.0 V to 3.6 V (3.3 V representative). Operating temperature range 0 °C to 70 °C. RoHS compliant.
  • Design Integration – Industry tool flow compatibility and automatic component generators to accelerate synthesis, placement and routing for complex designs.

Typical Applications

  • Signal Processing & DSP Coprocessors – Implement FIR filters, FFTs, convolvers and other arithmetic-heavy blocks to offload and accelerate processor workloads.
  • Video and Multimedia Acceleration – Support for fast vector multipliers and distributed RAM enables compression/decompression and transform functions used in video pipelines.
  • Security & Encryption – High logic density and embedded RAM allow hardware implementation of encryption cores and related cryptographic accelerators.
  • High‑I/O System Interfaces – PCI-compliant I/Os and programmable drive strengths are suitable for designs requiring dense external interfacing and pin-locking flexibility.

Unique Advantages

  • Dynamic In-System Reconfiguration – Cache Logic capability enables partial or full reconfiguration without loss of data, supporting adaptive and upgradable systems.
  • On-Chip, Fast SRAM – Approximately 18,432 bits of distributed 10 ns RAM reduce dependence on external memory and preserve logic resources for higher‑level functions.
  • Balanced Performance and Capacity – Combines 2,304 logic elements with up to 50,000 gates and high-speed multipliers for compute-intensive applications.
  • Robust Clocking Resources – Eight global clocks and additional PCI clocks deliver low-skew distribution and flexible edge/transition control for complex timing domains.
  • Compact, High-Density Packaging – 352-ball BGA package provides high pin count and board-level density for designs constrained by PCB real estate.

Why Choose AT40K40AL-1BGC?

The AT40K40AL-1BGC positions itself as a versatile, mid-to-high capacity FPGA optimized for designs that need a combination of embedded RAM, fast multipliers and in-system reconfigurability. Its feature set is oriented toward engineers developing DSP acceleration, multimedia processing and high‑I/O interface logic where reprogrammability and on-chip memory reduce system complexity.

With commercial operating range, RoHS compliance, and a 352-ball BGA footprint, this device addresses projects that require dense I/O, deterministic performance and flexible update mechanisms while supporting standard 3.3 V system environments.

Request a quote or submit an inquiry to receive pricing and availability for the AT40K40AL-1BGC. Our team can provide lead-time details and support for volume requirements.

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