AT40K40LV-3BQC

The AT40K40LV-3BQC is a commercial-grade, surface-mount SRAM-based FPGA in a 144-pin LQFP package. It provides a mid‑to‑high gate-count FPGA architecture with 2,304 logic elements and 18,432 bits of distributed on-chip RAM targeted at system-level digital logic, DSP acceleration, and reconfigurable designs.

This device combines on-chip memory, multi-clock support and dynamic reconfiguration capabilities to support applications that require flexible logic, embedded RAM and a significant I/O count in a compact 20 × 20 mm TQFP-compatible footprint.

Key Features

• Core Capacity — Approximately 50,000 usable gates implemented as 2,304 logic elements (cells) and 2,304 registers, providing substantial logic density for mid-range FPGA tasks.
• Embedded Memory (FreeRAM) — 18,432 bits of distributed SRAM (10 ns) that can be configured as single- or dual-port, synchronous or asynchronous RAM for FIFOs, scratch pads and buffer storage independent of logic elements.
• I/O and System Interfaces — 114 I/O pins available on the 144-LQFP package allowing extensive external interfacing and system connectivity; devices in the series support PCI‑compliant I/O architectures.
• Clocking — Multi-clock support with dedicated global clock resources described for the family, enabling low-skew clock distribution and flexible clock management for synchronous designs.
• Dynamic Reconfiguration (Cache Logic) — Series-level Cache Logic capability enables dynamic full or partial in-system reconfiguration without losing data, supporting adaptive designs and on-the-fly updates.
• Performance Elements — Series documentation cites system speeds to 100 MHz, array multipliers beyond 50 MHz and 10 ns SRAM performance, enabling DSP and arithmetic acceleration when leveraged by design tools.
• Power and Supply — Operates from a 3.0 V to 3.6 V supply range suitable for standard 3.3 V systems.
• Package and Mounting — 144-LQFP (supplier device package: 144-TQFP, 20×20 mm) in a surface-mount form factor for compact board-level integration.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature and specified as commercial grade.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• DSP Acceleration — Implement FIR filters, FFTs and other compute‑intensive arithmetic blocks using the device’s embedded RAM and array multiplier architecture.
• Coprocessor / Offload Logic — Serve as a reconfigurable coprocessor for processor-based systems to offload specialized algorithmic tasks and speed critical paths.
• High‑Density I/O Control — Use the 114 I/Os for interfacing sensors, peripherals and system buses in compact embedded platforms.
• Adaptive & Updatable Systems — Leverage dynamic partial/full reconfiguration for designs that require on-the-fly updates or adaptive behavior without halting operation.

Unique Advantages

• Flexible On‑Chip Memory: 18,432 bits of distributed FreeRAM allow efficient implementation of FIFOs and scratch-pad memory without consuming logic elements.
• Reconfigurability for Live Updates: Cache Logic dynamic reconfiguration supports design changes and coefficient updates without losing stored data, accelerating iterative development and field updates.
• Significant Logic Capacity: Roughly 50,000 usable gates across 2,304 logic elements provide enough density for complex mid-range designs while keeping board area small.
• Compact, Surface‑Mount Packaging: 144‑pin LQFP/TQFP footprint (20 × 20 mm) eases integration into space-constrained PCBs without resorting to larger BGA packages.
• 3.3 V System Compatibility: Operates from a 3.0 V to 3.6 V supply, matching common 3.3 V digital system rails for straightforward power design.
• RoHS Compliance: Meets environmental requirements for modern assembly processes.

Why Choose AT40K40LV-3BQC?

The AT40K40LV-3BQC positions itself as a versatile, commercial‑grade FPGA optimized for mid‑range digital and DSP applications where embedded RAM, reconfigurability and a moderate I/O count are required. Its combination of logic density, distributed SRAM and dynamic reconfiguration supports adaptive system architectures and iterative development workflows.

Teams targeting compact board layouts and conventional 3.3 V systems will find the 144-LQFP/TQFP package convenient for surface-mount assembly. The device benefits from the series’ established toolchain and migration paths, offering a pragmatic balance of performance, integration and development support for production and field-updatable designs.

Request a quote or submit a pricing and availability inquiry for the AT40K40LV-3BQC to receive lead-time and procurement information tailored to your project needs.