ICE40LM1K-SWG25TR

IC FPGA 18 I/O 25WLCSP
Part Description

iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 65536 1000 25-XFBGA, WLCSP

Quantity 854 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package25-WLCSP (1.7x1.7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-XFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs125Number of Logic Elements/Cells1000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of ICE40LM1K-SWG25TR – iCE40™ LM FPGA, 1,000 logic elements, 25‑WLCSP

The ICE40LM1K-SWG25TR is an ultra-low power iCE40™ LM family FPGA in a compact 25‑ball WLCSP (1.71 mm × 1.71 mm) package. It provides approximately 1,000 logic elements with embedded RAM and a set of integrated peripherals designed for mobile and always‑on sensor applications.

Targeted for space‑constrained, power‑sensitive designs, this device combines low standby power, hardened SPI and I²C blocks, and strobe generators to simplify sensor management, interface bridging, and small‑form‑factor control tasks.

Key Features

  • Core Logic Approximately 1,000 logic elements suitable for compact programmable logic and glue‑logic implementations.
  • Embedded Memory Approximately 64 kbits of on‑chip RAM (65,536 bits) for data buffering and small state machines.
  • Integrated Interfaces Hardened SPI and I²C controllers included in the iCE40LM family simplify sensor and processor interfacing without needing external controllers.
  • Strobe Generators Two on‑chip strobe generators provide low‑power microsecond‑range strobes and high‑speed nanosecond‑range strobes for timing‑sensitive sensor and LED control.
  • High‑Drive Outputs Three high‑drive outputs with nominal 24 mA source/sink capability support direct LED drive and other high‑current IO tasks.
  • I/O Count and Flexibility 18 I/O pins available; per‑pin pull‑up control allows flexible interfacing to sensors and external logic.
  • Low Power Built on an advanced 40 nm ultra‑low power process with standby power as low as 120 μW typical (family specification), making it suitable for always‑on and battery‑powered systems.
  • Clocking and Routing Six low‑skew global signal resources support synchronized clock distribution across the design.
  • Package and Mounting 25‑ball WLCSP (25‑XFBGA) package, 1.71 mm × 1.71 mm, surface‑mount mounting type for very small board footprints.
  • Voltage and Temperature Operating supply range 1.14 V to 1.26 V and industrial temperature range −40 °C to 100 °C.
  • RoHS Compliant Device is RoHS compliant.

Typical Applications

  • Smartphones and Mobile Devices — Sensor management, low‑power preprocessing, and interface bridging in compact mobile designs.
  • Tablets and Handheld Consumer Devices — Small programmable logic for user interface control, peripheral management, and LED control.
  • Handheld Commercial and Industrial Devices — Embedded logic and high‑drive outputs support compact instrumentation and field equipment.
  • Multi‑Sensor Management — Hardened I²C/SPI interfaces, strobe generators, and embedded memory enable sensor aggregation and preprocessing.
  • Always‑On Sensor Applications — Ultra‑low standby power and small package size suited for always‑on monitoring and gesture or motion front‑end tasks.

Unique Advantages

  • Highly Integrated Peripherals: Hardened SPI and I²C controllers plus strobe generators reduce external component count and simplify board design.
  • Compact, Low‑Power Package: 25‑ball WLCSP (1.71 mm × 1.71 mm) surface‑mount package delivers significant size savings for space‑constrained designs.
  • Always‑On Efficiency: Ultra‑low standby power characteristics help extend battery life in always‑on and low‑duty‑cycle systems.
  • Flexible I/O and Drive Capability: 18 programmable I/Os with per‑pin pull‑ups and three high‑drive outputs support diverse sensor and LED interfaces without external drivers.
  • Industrial Temperature Range: −40 °C to 100 °C rating enables deployment in commercial and industrial environments.
  • On‑Chip Memory for Local Processing: Approximately 64 kbits of embedded RAM supports buffering, small FIFOs, and temporary storage for sensor data aggregation.

Why Choose ICE40LM1K-SWG25TR?

The ICE40LM1K-SWG25TR positions itself as a compact, low‑power FPGA option for designs that require programmable logic in a very small footprint. With approximately 1,000 logic elements, integrated SPI/I²C controllers, strobe generators, and embedded RAM, it streamlines sensor management and interface tasks while minimizing BOM complexity.

This part is suited to engineers developing mobile, handheld, and always‑on sensor systems who need a balance of integration, low power, and industrial temperature capability. Backed by iCE40LM family features, it provides a scalable, reliable building block for compact embedded designs.

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