ICE40LM1K-SWG25TR1K

The iCE40LM1K-SWG25TR1K is an industrial‑grade, ultra‑low power FPGA in a compact 25‑ball WLCSP (1.7 × 1.7 mm) package. It provides 1,000 logic elements, 65,536 bits of on‑chip RAM and 18 configurable I/O pins, making it suitable for space‑constrained, always‑on sensor and control functions in mobile and industrial devices.

Built on the iCE40 LM family architecture, the device targets low‑power sensor management, interface bridging and custom logic tasks where minimal board area, low standby power and a small BOM are priorities.

Key Features

• Logic Capacity  1,000 logic elements with 125 logic array blocks (LABs) for implementing glue logic, sensor preprocessing and simple state machines.
• On‑Chip Memory  65,536 bits of embedded RAM to support buffering, small data tables and local state storage.
• I/O  18 configurable I/O pins in the 25‑WLCSP package for direct sensor and peripheral connections.
• Interfaces (family)  The iCE40LM family includes integrated SPI and I²C controller blocks suitable for interfacing with common mobile sensors and processors.
• Strobe Generators (family)  Family devices provide both low‑power and high‑speed strobe generators for microsecond and nanosecond timing requirements.
• Power  Operates from a nominal supply range of 1.14 V to 1.26 V to fit low‑voltage system rails.
• Package  25‑WLCSP (1.7 × 1.7 mm) ultra‑small form factor for compact system designs.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for use in challenging environments.
• RoHS Compliance  RoHS‑compliant device suitable for modern manufacturing requirements.

Typical Applications

• Always‑On Sensor Management  Low standby power and integrated serial interfaces enable sensor wake/sleep control and simple fusion tasks in battery‑powered devices.
• Mobile and Handheld Devices  Ultra‑small WLCSP package and low voltage operation fit tight board layouts for smartphones, tablets and handheld consumer products.
• Industrial Embedded Control  Industrial temperature rating and compact footprint support small form‑factor control and monitoring modules.
• Peripheral Bridging and GPIO Expansion  Use programmable logic to glue together different sensor buses, expand I/O or offload simple protocol handling from the main processor.

Unique Advantages

• Ultra‑compact integration: The 25‑WLCSP (1.7 × 1.7 mm) package allows high functionality in minimal PCB area, reducing overall system size.
• Low‑voltage operation: Narrow supply range (1.14 V to 1.26 V) enables direct integration with low‑voltage mobile power domains.
• Industrial temperature capability: −40 °C to 100 °C operation supports deployments in harsher environments where extended temperature performance is required.
• On‑chip RAM and I/O: 65,536 bits of embedded RAM and 18 I/O pins provide local buffering and direct sensor/peripheral interfacing to simplify system design.
• Family‑level peripheral support: The iCE40LM family includes integrated SPI/I²C controllers and strobe generator features, enabling common sensor and timing functions without extra silicon.
• RoHS compliant: Conforms to RoHS requirements for modern manufacturing and regulatory needs.

Why Choose ICE40LM1K-SWG25TR1K?

The ICE40LM1K-SWG25TR1K combines compact packaging, low‑voltage operation and an industrial temperature rating with a practical logic and memory footprint well suited to sensor management, peripheral interfacing and control functions. Its small WLCSP package and on‑chip resources help reduce BOM and conserve board space for compact and battery‑sensitive designs.

This device is ideal for engineers and product teams looking to integrate dedicated programmable logic into constrained mobile or industrial systems while leveraging the iCE40LM family’s on‑chip interfaces and timing features for streamlined system design.

Request a quote or submit an inquiry to learn about availability, pricing and ordering for the ICE40LM1K‑SWG25TR1K. Our team can provide purchasing guidance and support for your design requirements.