ICE40LM1K-SWG25TR50

The ICE40LM1K-SWG25TR50 is an industrial-grade iCE40 LM field programmable gate array (FPGA) IC from Lattice Semiconductor designed for ultra‑low power embedded applications. It integrates 1,000 logic elements with 125 CLBs and 65,536 bits of on-chip RAM in a compact 25‑ball WLCSP (1.71 mm × 1.71 mm) package, making it suited for space‑constrained sensor management and always‑on processing tasks.

Built for low power and flexible I/O, this device supports a 1.14 V to 1.26 V supply range, operates from −40 °C to 100 °C, and exposes 18 I/O pins for direct interfacing in mobile and handheld systems.

Key Features

• Core Logic  1,000 logic elements and 125 CLBs provide a compact, programmable fabric for control, preprocessing and glue‑logic functions.
• Embedded Memory  65,536 bits of on‑chip RAM support local data buffering and small lookup tables for sensor preprocessing and state machines.
• Interfaces  Hardened SPI and I²C controllers are included in the iCE40LM family (as documented in the device datasheet) to simplify integration with sensors and host processors.
• Strobe Generators & Timing  Two on‑chip strobe generators (low‑power and high‑speed ranges per family datasheet) provide configurable timing sources for sensor or LED control.
• I/O and Drive Capability  18 configurable I/O pins in the 25‑WLCSP package with three high‑drive outputs capable of nominal 24 mA source/sink per device (family feature from datasheet).
• Ultra‑Low Power Operation  Designed for low standby and active power; the family datasheet documents standby power as low as 120 μW typical, enabling always‑on sensor applications.
• Package & Mounting  25‑WLCSP (25‑XFBGA) package, 1.71 mm × 1.71 mm, surface mount mounting type for minimal PCB area and low profile integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial and commercial handheld environments.

Typical Applications

• Mobile and Handheld Devices  Compact package and low standby power make it suitable for smartphones, tablets and consumer handheld control tasks.
• Multi‑Sensor Management  Hardened I²C/SPI interfaces and on‑chip RAM enable sensor aggregation, preprocessing and fusion in low‑power systems.
• Always‑On Sensor Applications  Ultra‑low standby power supports duty‑cycling and continuous monitoring use cases such as motion detection and gesture recognition.
• Industrial Handhelds  Small footprint and industrial temperature rating suit portable commercial and industrial devices requiring reprogrammable logic.

Unique Advantages

• Highly integrated, compact solution: 1,000 logic elements, 65,536 bits RAM and 18 I/Os in a 1.71 mm × 1.71 mm WLCSP reduce PCB area and BOM count for space‑constrained designs.
• Low supply voltage operation: Narrow supply range of 1.14 V to 1.26 V supports low‑power system architectures and simplifies power budgeting.
• Low standby power capability: Family‑level standby power documented as low as 120 μW typical enables battery‑friendly always‑on functions.
• Sensor‑friendly peripherals: Integrated SPI and I²C controllers (family features) streamline connectivity to common sensors and host processors without external bridge logic.
• Robust industrial rating: Operation from −40 °C to 100 °C supports deployment in demanding commercial and industrial handheld environments.
• High‑drive outputs: Dedicated high‑drive outputs (family feature) provide nominal 24 mA source/sink capability for driving LEDs and other loads directly.

Why Choose ICE40LM1K-SWG25TR50?

The ICE40LM1K-SWG25TR50 packages a reprogrammable logic fabric, embedded RAM and sensor‑oriented interfaces into an ultra‑small WLCSP footprint designed for industrial temperature operation. It is well suited to engineers building compact, low‑power sensor management, always‑on preprocessing, and handheld control applications that require reconfigurable logic without large form factor penalties.

Supported by family datasheet features and Lattice design resources referenced in the documentation, this device offers a balance of integration, low power and rugged temperature capability for designs that demand compactness and flexibility over the product lifecycle.

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