ICE40LM4K-SWG25TR50
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 3520 25-XFBGA, WLCSP |
|---|---|
| Quantity | 1,567 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 25-WLCSP (1.7x1.7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 25-XFBGA, WLCSP | Number of I/O | 18 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM4K-SWG25TR50 – iCE40™ LM Ultra-Low Power FPGA, 3,520 Logic Elements, 25‑WLCSP
The ICE40LM4K-SWG25TR50 is an ultra-low power field programmable gate array (FPGA) from the iCE40 LM family, designed for compact mobile and always-on sensor applications. It combines programmable logic, embedded memory and hardened serial interfaces in a very small 25‑pin WLCSP package for space-constrained designs.
Built on an advanced 40 nm low-power process, the device targets mobile and handheld systems that require low standby power, flexible I/O and sensor-management capabilities while operating over an industrial temperature range.
Key Features
- Core Logic 3,520 logic elements to implement control, glue logic and small to mid-scale finite-state and signal-processing functions.
- Embedded Memory 81,920 bits of on-chip RAM for data buffering, small lookup tables and state storage.
- Integrated Serial Interfaces Two hardened I²C controllers and two hardened SPI controllers for direct sensor and peripheral interfacing.
- Strobe Generators Two on-chip strobe generators: a low-power strobe generator for microsecond-range timing and a high-speed strobe generator for nanosecond-range timing.
- GPIO and High-Drive Outputs Up to 18 I/O pins with three high-drive outputs capable of nominally 24 mA source/sink for LED or indicator drive.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V and typical standby power as low as 120 μW.
- Clocking and Configuration Six low-skew global routing resources for clock distribution and SRAM configuration via SPI.
- Package and Mounting 25-pin WLCSP (1.71 mm × 1.71 mm) surface-mount package suitable for ultra-small form-factor assemblies.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
Typical Applications
- Smartphones and Mobile Devices Sensor management, low-power glue logic and peripheral interfacing where ultra-small package size and low standby power are critical.
- Tablets and Handheld Consumer Electronics User-interface control, sensor pre-processing and protocol bridging in compact handheld products.
- Multi-Sensor Management Aggregation and pre-processing of multiple sensor streams using on-chip RAM and integrated I²C/SPI interfaces.
- Always‑On and Low-Power Sensor Nodes Duty-cycled monitoring and wake-up control leveraging very low standby power and strobe generators for precise timing.
Unique Advantages
- Ultra‑low standby power: Typical standby power down to 120 μW enables always‑on sensor and mobile applications with minimal energy impact.
- Compact footprint: 25‑pin WLCSP (1.71 mm × 1.71 mm) package reduces PCB area and supports dense system integration.
- Integrated sensor interfaces: Two hardened I²C and two SPI controllers simplify sensor connectivity and reduce external component count.
- Flexible timing resources: Dual strobe generators (microsecond and nanosecond ranges) and six global routing resources provide precise timing and clock distribution.
- Industrial temperature range: Rated for −40 °C to 100 °C, supporting a wide range of environmental conditions.
- Embedded memory for buffering: 81,920 bits of on-chip RAM for local data storage, lookup tables and state machines without external memory.
Why Choose ICE40LM4K-SWG25TR50?
The ICE40LM4K-SWG25TR50 positions itself as a compact, energy-efficient FPGA option for developers building mobile, handheld and always‑on sensor systems. With 3,520 logic elements, integrated serial controllers, dedicated strobe generators and on‑chip RAM, it provides a balanced combination of programmability and integration that reduces BOM complexity and board area.
This industrial-grade device is suited for engineers who need low-power operation, precise timing control and small-package integration. Its support for SPI configuration and hardened interfaces makes it practical for rapid prototyping and volume designs that rely on a proven FPGA ecosystem.
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