ICE40LM4K-SWG25TR1K

IC FPGA 18 I/O 25WLCSP
Part Description

iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 3520 25-XFBGA, WLCSP

Quantity 407 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package25-WLCSP (1.7x1.7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-XFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE40LM4K-SWG25TR1K – iCE40™ LM FPGA, 3520 logic elements, 25‑WLCSP

The ICE40LM4K-SWG25TR1K from Lattice Semiconductor is an ultra‑small, ultra‑low‑power Field Programmable Gate Array (FPGA) in a 25‑ball WLCSP package. It provides 3520 logic elements, approximately 80 kbits of embedded RAM, and 18 programmable I/O pins tailored for mobile, always‑on sensor management and compact embedded applications.

Designed for low power and compact footprints, this device integrates hardened SPI and I2C controllers plus on‑chip strobe generators and high‑drive outputs to simplify sensor interfacing and control tasks in space‑constrained systems.

Key Features

  • Core Logic  3520 logic elements (LUTs) for implementing custom control, glue logic, and sensor pre‑processing functions.
  • Embedded Memory  Approximately 80 kbits of sysMEM™ Embedded Block RAM to support buffering, small FIFOs, and local data storage.
  • Interfaces  Two hardened I2C controllers and two hardened SPI controllers allow direct connection to a wide range of sensors and host processors.
  • Low‑Power Operation  Fabricated on a 40 nm low‑power process with standby currents as low as 120 μW (typical), enabling always‑on and battery‑sensitive use cases.
  • Strobe Generators  Two on‑chip strobe generators: a Low‑Power Strobe Generator (microsecond ranges) and a High‑Speed Strobe Generator (nanosecond ranges) for precise timing control.
  • I/O and Drive Capability  18 I/O pins with per‑pin pull‑up control and three high‑drive outputs capable of nominal 24 mA source/sink to directly drive LEDs or similar loads.
  • Clocking Resources  Six low‑skew global clock resources to support synchronous designs and global control signals.
  • Package & Mounting  25‑ball WLCSP (1.71 mm × 1.71 mm) surface‑mount package for ultra‑small PCB footprints.
  • Operating Range & Compliance  Voltage supply 1.14 V to 1.26 V; industrial operating temperature −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • Mobile Sensor Management  Always‑on sensor hubs, pre‑processing and sensor fusion for compact handheld or wearable devices where low standby power and small size matter.
  • Embedded Control & Glue Logic  Bridge logic, protocol adaptation, and peripheral aggregation in systems requiring a tiny FPGA footprint and flexible I/O.
  • Consumer Handheld Devices  Function offload, LED driving, and interface control in smartphones, tablets, and other consumer handheld electronics.
  • Industrial Handheld Instruments  Compact, low‑power implementations of user interface controllers, IR remote handling, or bar code emulation in industrial handheld equipment.

Unique Advantages

  • Ultra‑small footprint: Minimal PCB area with a 25‑ball WLCSP (1.71 mm × 1.71 mm) package to fit space‑constrained designs.
  • Low standby power: Typical standby power as low as 120 μW, enabling always‑on sensor tasks without significant battery impact.
  • Integrated sensor interfaces: Hardened I2C and SPI controllers reduce external components and simplify sensor connectivity.
  • On‑chip timing generators: Low‑power and high‑speed strobe generators provide precise timing without external timers or FPGAs.
  • Direct drive capability: High‑drive outputs (nominal 24 mA) support LED and similar loads directly, lowering BOM count.
  • Industrial temperature grade: Specified for −40 °C to 100 °C operation, supporting a wide range of environmental conditions.

Why Choose ICE40LM4K-SWG25TR1K?

The ICE40LM4K-SWG25TR1K balances compact form factor, low power, and integrated peripherals to deliver a practical FPGA solution for designers of mobile, handheld, and embedded sensor systems. With 3520 logic elements, approximately 80 kbits of embedded RAM, hardened SPI/I2C controllers, and precise on‑chip strobe generators, it reduces external component count and simplifies system integration.

This device suits teams needing a small, industrial‑grade FPGA that supports always‑on functionality, sensor interfacing, and direct drive outputs while keeping PCB area and power consumption to a minimum. Backed by Lattice’s device architecture and tool support, it offers a scalable option for compact embedded designs.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the ICE40LM4K-SWG25TR1K.

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