ICE40LM4K-CM36TR1K
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 28 81920 3520 36-VFBGA |
|---|---|
| Quantity | 1,802 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 36-UCBGA (2.5x2.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-VFBGA | Number of I/O | 28 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM4K-CM36TR1K – iCE40™ LM FPGA, 3,520 logic elements, 36‑VFBGA
The ICE40LM4K-CM36TR1K is an ultra-low power Field Programmable Gate Array (FPGA) in the iCE40LM family, delivering 3,520 logic elements and approximately 80 kbits of embedded RAM in a compact 36‑VFBGA package. Designed for low-power mobile and industrial sensor-management roles, this device integrates hardened serial interfaces and strobe generators to streamline sensor interfacing, pre-processing and control tasks while operating across a 1.14 V to 1.26 V supply range.
Key Features
- Core Logic 3,520 logic elements (LUT-based architecture) suitable for implementing control, glue logic and sensor pre-processing functions.
- On‑chip Memory Approximately 80 kbits of embedded RAM to support buffering, small FIFOs and local data storage for sensor and control logic.
- Interfaces Family-level features include two hardened I²C controllers and two hardened SPI controllers that simplify integration with a wide range of sensors and application processors.
- Strobe Generators Two on‑chip strobe generators—low‑power (microsecond range) and high‑speed (nanosecond range)—for precise timing and sensor drive tasks.
- I/O 28 programmable I/O pins in the 36‑VFBGA package; I/Os can be configured for serial interfaces or general-purpose I/O.
- High‑Drive Outputs Three high‑drive outputs per device with nominal source/sink capability of 24 mA for LED drive or other moderate current loads.
- Power Optimized for ultra‑low power operation on a 1.14 V–1.26 V core supply to support always‑on and battery‑sensitive applications.
- Clocking Flexible on‑chip clock resources including six low‑skew global signals for predictable timing distribution.
- Package & Mounting 36‑VFBGA (supplier package: 36‑UCBGA, 2.5 × 2.5 mm) surface‑mount package suitable for compact system designs.
- Operating Range & Compliance Industrial temperature range from −40 °C to 100 °C and RoHS compliant for lead‑free manufacturing environments.
Typical Applications
- Mobile and Handheld Devices Sensor aggregation and low‑power control tasks in smartphones, tablets and other handheld consumer devices.
- Always‑On Sensor Management Low‑power monitoring and pre‑processing for motion, proximity and environmental sensors.
- Multi‑Sensor Fusion Local data buffering and glue logic to combine inputs from multiple sensors prior to system‑level processing.
- Embedded Interfaces and Bridge Functions Implement SPI/I²C bridging, GPIO expansion and modest protocol translation in compact systems.
Unique Advantages
- Ultra‑low power architecture: The device’s low core voltage range and family design target minimal standby and active power for battery‑sensitive applications.
- Integrated serial controllers: Hardened SPI and I²C blocks reduce software overhead and BOM complexity when interfacing with sensors and peripherals.
- On‑chip timing resources: Dual strobe generators and low‑skew global clocking provide precise timing for sensor drive and time‑critical I/O without external components.
- Compact, surface‑mount package: The 36‑VFBGA (2.5 × 2.5 mm) footprint enables high‑density board layouts and space‑constrained designs.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to support commercial and industrial-grade deployments.
- Reduced system complexity: Logic, memory and interface primitives in a single device lower component count and simplify integration.
Why Choose ICE40LM4K-CM36TR1K?
The ICE40LM4K-CM36TR1K positions itself as a compact, ultra‑low power FPGA option for engineers building sensor‑centric and space‑constrained systems. With 3,520 logic elements, approximately 80 kbits of embedded RAM, hardened SPI/I²C controllers and strobe generators, it combines the building blocks needed for sensor management, interface bridging and always‑on tasks in a single surface‑mount package.
Its industrial temperature range, RoHS compliance and small 36‑VFBGA footprint make the device suitable for designs where power, size and reliable operation across temperature are key requirements. The iCE40LM family resources and device configuration options offer a practical platform for streamlining BOMs and accelerating time to market.
Request a quote or submit an inquiry to receive pricing, lead‑time and availability for the ICE40LM4K-CM36TR1K.

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