ICE40LM4K-CM36
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 28 81920 3520 36-VFBGA |
|---|---|
| Quantity | 1,231 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 36-UCBGA (2.5x2.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-VFBGA | Number of I/O | 28 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM4K-CM36 – iCE40™ LM FPGA, 3,520 logic elements, ~80 Kbit RAM, 36‑VFBGA
The ICE40LM4K-CM36 is an iCE40™ LM family Field Programmable Gate Array (FPGA) in a 36‑ball VFBGA package designed for ultra‑low power, compact embedded designs. It implements 3,520 logic elements and approximately 81,920 bits (≈80 Kbits) of embedded RAM alongside hardened serial interfaces and strobe generators to support sensor management, mobile and handheld applications.
With an industrial operating temperature range and a low core supply voltage window, this device targets low‑power sensor preprocessing, interface bridging and compact control functions where small form factor, integrated peripherals and robust temperature performance matter.
Key Features
- Core Logic 3,520 logic elements (LUT-based architecture) for implementing custom control, glue logic and sensor processing functions.
- Embedded Memory Approximately 81,920 bits (≈80 Kbits) of on‑chip RAM for buffering, lookup tables and small data stores.
- Hardened Serial Interfaces Two SPI controllers and two I²C controllers are included to simplify direct sensor and peripheral connectivity without adding external controller ICs.
- Strobe Generators Two on‑chip strobe generators: a Low‑Power Strobe Generator (microsecond ranges) and a High‑Speed Strobe Generator (nanosecond ranges) for timing-critical sensor or interface tasks.
- High‑Drive Outputs Three high‑drive outputs capable of source/sink nominally 24 mA for driving LEDs or other moderate‑current loads directly from the device.
- Power and Clocking Designed on an advanced 40 nm low‑power process with flexible on‑chip clocking and a core supply range of 1.14 V to 1.26 V to support low power system designs.
- Package & Mounting 36‑VFBGA package (supplier package 36‑UCBGA, 2.5 × 2.5 mm) intended for surface‑mount PCB assembly in space‑constrained designs.
- Industrial Temperature Range Operates from ‑40 °C to 100 °C, suitable for industrial and rugged handheld environments.
- Compliance RoHS compliant construction for regulatory and manufacturing compatibility.
Typical Applications
- Smartphones and Mobile Devices Always‑on sensor management and low‑power preprocessing where compact size and low standby current are critical.
- Tablets & Consumer Handhelds Peripheral interfacing, gesture or motion preprocessing, and glue logic between sensors and application processors.
- Multi‑Sensor Management Aggregating and preprocessing multiple sensor streams using on‑chip SPI/I²C controllers and embedded RAM to reduce host processor load.
- Industrial & Commercial Handhelds Control, user‑interface handling and peripheral bridging in handheld devices that require industrial temperature operation.
Unique Advantages
- Highly integrated serial interfaces Built‑in SPI and I²C controllers reduce BOM count and simplify board-level design for sensor and peripheral connectivity.
- Compact, production‑ready package 36‑ball VFBGA (36‑UCBGA 2.5 × 2.5 mm) enables small PCB footprint without sacrificing I/O count.
- Low core voltage operation Narrow 1.14 V to 1.26 V supply window supports low‑power system architectures and efficient power management.
- On‑chip timing primitives Dual strobe generators provide both microsecond and nanosecond timing capabilities for a wide range of sensor and timing applications.
- Embedded memory and logic density Approximately 80 Kbits of RAM paired with 3,520 logic elements allows modest buffering and moderate‑complexity logic functions on a single device.
- Industrial temperature qualification Rated for ‑40 °C to 100 °C operation for deployments in demanding environmental conditions.
Why Choose ICE40LM4K-CM36?
The ICE40LM4K-CM36 combines a compact 36‑ball VFBGA footprint with a balanced mix of logic density, embedded memory and hardened peripheral controllers to address low‑power sensor management and interface tasks in space‑constrained designs. Its integrated strobe generators and high‑drive outputs add practical on‑chip functionality that can reduce external components and simplify system design.
This part is positioned for designers needing a low‑power FPGA with integrated serial interfaces and durable temperature performance—ideal for mobile, handheld and industrial applications where board area, power and integration are key considerations. The device’s feature set supports scalable implementations and streamlined BOMs for high‑volume or space‑sensitive products.
Request a quote or submit an inquiry to receive pricing and availability for ICE40LM4K-CM36 and to discuss how it can fit into your next design.