ICE40LM2K-SWG25TR50

IC FPGA 18 I/O 25WLCSP
Part Description

iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 2000 25-XFBGA, WLCSP

Quantity 444 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package25-WLCSP (1.7x1.7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-XFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells2000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE40LM2K-SWG25TR50 – iCE40™ LM Field Programmable Gate Array (FPGA)

The ICE40LM2K-SWG25TR50 is an ultra-compact, ultra-low-power FPGA in the iCE40LM family, optimized for mobile and always-on sensor management applications. This device combines programmable logic with embedded memory and hardened serial interfaces to deliver sensor interfacing, pre-processing, and system-bridging functionality in a 25‑pin WLCSP footprint.

Key value comes from its small package and low-voltage operation (1.14–1.26 V), making it suitable for space-constrained, power-sensitive designs that require configurable logic, on-chip memory and integrated I²C/SPI controllers.

Key Features

  • Logic Capacity  Approximately 2,000 logic elements for implementing glue logic, finite-state machines, and lightweight datapaths.
  • Embedded Memory  Approximately 80 Kbits of on-chip RAM (81,920 bits) for buffering, small lookup tables and state storage.
  • Integrated Serial Interfaces  Two hardened I²C controllers and two hardened SPI controllers to interface directly with sensors and host processors.
  • On-chip Strobe Generators  Two strobe generators: a Low-Power Strobe Generator (microsecond-range strobes) and a High-Speed Strobe Generator (nanosecond-range strobes) for timing-critical sensor or LED control.
  • High-Drive Outputs  Three high-drive outputs with source/sink nominal 24 mA capability for LED driving or other moderate-load I/O tasks.
  • Clocking Resources  Six low-skew global clock resources to simplify distribution of timing-critical signals across the fabric.
  • Compact Package  25-pin WLCSP (approx. 1.71 mm × 1.71 mm) for minimal PCB area and dense system integration.
  • I/O Count and Configurability  18 programmable I/O pins; on-chip pull-up control available on a per-pin basis.
  • Power and Temperature  Low-voltage operation (1.14–1.26 V) and industrial operating range (–40 °C to 100 °C).

Typical Applications

  • Smartphones and Mobile Devices  Sensor interfacing, low-power sensor managers and peripheral bridging in compact mobile designs.
  • Tablets and Handheld Consumer Devices  Always-on sensor preprocessing, gesture recognition and user-interface glue logic where PCB space and power budget are constrained.
  • Industrial Handhelds  Compact logic and sensor aggregation in handheld commercial and industrial devices operating across an extended temperature range.
  • Multi-Sensor Management  Integrate multiple SPI/I²C sensors, perform lightweight sensor fusion or preprocessing before handing data to a host MCU or application processor.
  • LED and Strobe Control  High-drive outputs and on-chip strobe generators for LED strobes and timing-critical illumination control.

Unique Advantages

  • Ultra-small form factor: The 25‑pin WLCSP (≈1.71 mm × 1.71 mm) minimizes board area for compact system designs.
  • Low-voltage, low-power operation: Narrow supply range (1.14–1.26 V) and family-level ultra-low-power design reduce system power for battery-powered products.
  • Integrated sensor interfaces: Hardened I²C and SPI controllers reduce external components and simplify sensor connectivity.
  • Built-in timing primitives: Dual strobe generators and six low-skew global clocks make it easier to implement precise timing and synchronous logic.
  • On-chip memory for buffering: Approximately 80 Kbits of embedded RAM supports local data storage without external RAM.
  • Industrial temperature support: Rated for –40 °C to 100 °C operation for deployment in extended-temperature environments.

Why Choose ICE40LM2K-SWG25TR50?

The ICE40LM2K-SWG25TR50 positions itself as a compact, low-power programmable logic option for designs that need configurable glue logic, sensor management, and small embedded memory in a minimal footprint. Its combination of approximately 2,000 logic elements, approximately 80 Kbits of RAM, hardened I²C/SPI, strobe generators and high-drive outputs provides a balanced set of resources for mobile and always-on applications.

Supporting design tools and pre-engineered IP for the iCE40LM family help accelerate development and integration, making this device a practical choice for engineers building space- and power-constrained systems that require flexible, on-board programmability.

Request a quote or submit a purchase inquiry to evaluate the ICE40LM2K-SWG25TR50 for your next design.

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