ICE40LM2K-SWG25TR50
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 2000 25-XFBGA, WLCSP |
|---|---|
| Quantity | 444 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 25-WLCSP (1.7x1.7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 25-XFBGA, WLCSP | Number of I/O | 18 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 2000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM2K-SWG25TR50 – iCE40™ LM Field Programmable Gate Array (FPGA)
The ICE40LM2K-SWG25TR50 is an ultra-compact, ultra-low-power FPGA in the iCE40LM family, optimized for mobile and always-on sensor management applications. This device combines programmable logic with embedded memory and hardened serial interfaces to deliver sensor interfacing, pre-processing, and system-bridging functionality in a 25‑pin WLCSP footprint.
Key value comes from its small package and low-voltage operation (1.14–1.26 V), making it suitable for space-constrained, power-sensitive designs that require configurable logic, on-chip memory and integrated I²C/SPI controllers.
Key Features
- Logic Capacity Approximately 2,000 logic elements for implementing glue logic, finite-state machines, and lightweight datapaths.
- Embedded Memory Approximately 80 Kbits of on-chip RAM (81,920 bits) for buffering, small lookup tables and state storage.
- Integrated Serial Interfaces Two hardened I²C controllers and two hardened SPI controllers to interface directly with sensors and host processors.
- On-chip Strobe Generators Two strobe generators: a Low-Power Strobe Generator (microsecond-range strobes) and a High-Speed Strobe Generator (nanosecond-range strobes) for timing-critical sensor or LED control.
- High-Drive Outputs Three high-drive outputs with source/sink nominal 24 mA capability for LED driving or other moderate-load I/O tasks.
- Clocking Resources Six low-skew global clock resources to simplify distribution of timing-critical signals across the fabric.
- Compact Package 25-pin WLCSP (approx. 1.71 mm × 1.71 mm) for minimal PCB area and dense system integration.
- I/O Count and Configurability 18 programmable I/O pins; on-chip pull-up control available on a per-pin basis.
- Power and Temperature Low-voltage operation (1.14–1.26 V) and industrial operating range (–40 °C to 100 °C).
Typical Applications
- Smartphones and Mobile Devices Sensor interfacing, low-power sensor managers and peripheral bridging in compact mobile designs.
- Tablets and Handheld Consumer Devices Always-on sensor preprocessing, gesture recognition and user-interface glue logic where PCB space and power budget are constrained.
- Industrial Handhelds Compact logic and sensor aggregation in handheld commercial and industrial devices operating across an extended temperature range.
- Multi-Sensor Management Integrate multiple SPI/I²C sensors, perform lightweight sensor fusion or preprocessing before handing data to a host MCU or application processor.
- LED and Strobe Control High-drive outputs and on-chip strobe generators for LED strobes and timing-critical illumination control.
Unique Advantages
- Ultra-small form factor: The 25‑pin WLCSP (≈1.71 mm × 1.71 mm) minimizes board area for compact system designs.
- Low-voltage, low-power operation: Narrow supply range (1.14–1.26 V) and family-level ultra-low-power design reduce system power for battery-powered products.
- Integrated sensor interfaces: Hardened I²C and SPI controllers reduce external components and simplify sensor connectivity.
- Built-in timing primitives: Dual strobe generators and six low-skew global clocks make it easier to implement precise timing and synchronous logic.
- On-chip memory for buffering: Approximately 80 Kbits of embedded RAM supports local data storage without external RAM.
- Industrial temperature support: Rated for –40 °C to 100 °C operation for deployment in extended-temperature environments.
Why Choose ICE40LM2K-SWG25TR50?
The ICE40LM2K-SWG25TR50 positions itself as a compact, low-power programmable logic option for designs that need configurable glue logic, sensor management, and small embedded memory in a minimal footprint. Its combination of approximately 2,000 logic elements, approximately 80 Kbits of RAM, hardened I²C/SPI, strobe generators and high-drive outputs provides a balanced set of resources for mobile and always-on applications.
Supporting design tools and pre-engineered IP for the iCE40LM family help accelerate development and integration, making this device a practical choice for engineers building space- and power-constrained systems that require flexible, on-board programmability.
Request a quote or submit a purchase inquiry to evaluate the ICE40LM2K-SWG25TR50 for your next design.