ICE40LM2K-SWG25TR1K

IC FPGA 18 I/O 25WLCSP
Part Description

iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 2000 25-XFBGA, WLCSP

Quantity 761 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package25-WLCSP (1.7x1.7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-XFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells2000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE40LM2K-SWG25TR1K – iCE40™ LM FPGA, 2,000 logic elements, 25-WLCSP (1.71×1.71 mm)

The ICE40LM2K-SWG25TR1K is an ultra-low power iCE40™ LM series Field Programmable Gate Array (FPGA) in a compact 25-pin WLCSP package. It combines approximately 2,000 logic elements with on-chip embedded memory and hardened serial interfaces to address mobile and always-on sensor management use cases.

Designed for space-constrained, industrial-grade applications, this device delivers integrated SPI and I²C controllers, on-chip strobe generators, and high-drive outputs while operating across a 1.14 V–1.26 V supply range and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 2,000 logic elements for implementing custom control, sensor pre-processing, and bridging functions.
  • Embedded Memory  Approximately 80 kbits of on-chip RAM (81,920 bits total) to support local buffering and small data-paths without external memory.
  • Interfaces  Two hardened I²C and two hardened SPI controllers (series-level feature) enable direct connection to sensors and host processors for sensor management and data aggregation.
  • Strobe Generators  On-chip Low-Power and High-Speed Strobe Generators provide microsecond- and nanosecond-range timing resources for sensor timing, LED strobes, or external device triggering.
  • I/O and Drive  18 general-purpose I/O pins in the 25-WLCSP package, with three High Drive outputs capable of nominally 24 mA source/sink for driving LEDs and other loads.
  • Power  Operates from a narrow core supply range of 1.14 V to 1.26 V, suitable for low-power mobile and battery-operated designs.
  • Package & Mounting  25-WLCSP (1.7 mm × 1.7 mm) surface-mount package for extremely small form-factor designs.
  • Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
  • Environmental Compliance  RoHS compliant.
  • Design Ecosystem  Series-level support includes design tools and pre-engineered IP from the vendor to accelerate development and time-to-market.

Typical Applications

  • Mobile Devices  Sensor management and pre-processing in smartphones, tablets, and other handheld devices where low power and small footprint are essential.
  • Always-On Sensor Hubs  Low-power monitoring and event detection using embedded SPI/I²C interfaces and strobe timing for efficient sensor control.
  • Industrial Handhelds  Compact control and interface logic in industrial-grade handheld tools and instruments operating across −40 °C to 100 °C.
  • Sensor Fusion & Pre-processing  Local aggregation and simple preprocessing of multiple sensor inputs to reduce host processor load and data traffic.

Unique Advantages

  • Ultra-small footprint: 25-WLCSP package (1.71 mm × 1.71 mm) enables integration into tight board layouts and compact products.
  • Low-power operation: Narrow core voltage range and family-level ultra-low power design reduce standby and runtime power for battery-powered systems.
  • Integrated serial controllers: Hardened SPI and I²C blocks simplify sensor connectivity and reduce external component count.
  • On-chip timing primitives: Low-Power and High-Speed Strobe Generators provide flexible timing without additional external timers or MCU overhead.
  • High-drive outputs: Three dedicated high-drive outputs (nominal 24 mA) allow direct driving of LEDs and small loads, cutting BOM complexity.
  • Industrial temperature range: −40 °C to 100 °C operation supports deployment in a wide range of commercial and industrial environments.

Why Choose ICE40LM2K-SWG25TR1K?

The ICE40LM2K-SWG25TR1K positions itself as a compact, low-power FPGA solution tailored for sensor-centric and mobile applications that require on-board logic, small embedded memory, and integrated serial interfaces. Its mix of approximately 2,000 logic elements, roughly 80 kbits of embedded RAM, and dedicated timing and interface blocks makes it suitable for designs that need local processing and deterministic I/O control in a very small package.

Engineers building space-constrained, industrial-grade devices will find value in the device’s small WLCSP footprint, high-drive outputs, and vendor-provided design tools and IP that help accelerate prototyping and production designs while keeping system-level BOM and power under control.

If you would like pricing, lead-time information, or a formal quote for ICE40LM2K-SWG25TR1K, request a quote or submit an inquiry to receive availability and purchasing details.

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