ICE40LM2K-SWG25TR

IC FPGA 18 I/O 25WLCSP
Part Description

iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 2000 25-XFBGA, WLCSP

Quantity 1,118 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package25-WLCSP (1.7x1.7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-XFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells2000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE40LM2K-SWG25TR – iCE40 LM FPGA, 2000 logic elements, 25-WLCSP

The ICE40LM2K-SWG25TR is a compact, ultra-low power Field Programmable Gate Array (FPGA) IC from the iCE40 LM family. It delivers 2,000 logic elements with approximately 81.9 kbits of embedded RAM in a 25-ball WLCSP package, optimized for mobile and sensor-management roles where size, power and integration matter.

Designed for applications such as smartphones, tablets and handheld devices, this industrial-grade device integrates hardened I²C and SPI controllers, on-chip strobe generators and flexible I/O, enabling sensor interfacing, pre-processing and always-on logic in a minimal footprint.

Key Features

  • Core Logic 2,000 logic elements provide a compact programmable fabric suitable for control, glue logic and sensor preprocessing tasks.
  • Embedded Memory Approximately 81.9 kbits of on-chip RAM for storing state, buffers or small data sets close to logic.
  • Interfaces Two hardened I²C controllers and two hardened SPI controllers are available for direct sensor and peripheral connectivity.
  • Strobe Generators Includes both a Low-Power Strobe Generator (microsecond ranges) and a High-Speed Strobe Generator (nanosecond ranges) for timing-critical sensor and LED control.
  • I/O and Drive 18 I/O pins in the 25-pin WLCSP package; three high-drive outputs with nominal 24 mA source/sink capability for direct LED or load driving.
  • Clocking Six low-skew global signal resources for flexible, low-skew on-chip clocking and distribution.
  • Configuration SRAM configuration via SPI with per-pin controllable pull-ups for flexible boot and interface behavior.
  • Power Ultra-low power design with standby power as low as 120 μW typical; supported supply range is 1.14 V to 1.26 V.
  • Package & Mounting 25-XFBGA WLCSP (25-WLCSP, 1.71 mm × 1.71 mm) surface-mount package—ideal for constrained board space.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for demanding ambient conditions.

Typical Applications

  • Mobile Devices Sensor interface, pre-processing and glue logic in smartphones, tablets and other handheld consumer devices where board space and power are limited.
  • Multi-Sensor Management Centralized sensor aggregation, low-latency I²C/SPI bridging and simple sensor fusion tasks for always-on sensor systems.
  • Industrial Handhelds Compact programmable logic for handheld commercial and industrial devices requiring industrial temperature operation and reliable I/O control.
  • Always-On and Low-Power Systems Low standby power and on-chip strobe generators make the device suitable for always-on sensor monitoring and event-driven wake-up logic.

Unique Advantages

  • Highly integrated peripheral set: On-chip dual I²C and SPI controllers reduce external components and simplify sensor connectivity.
  • Ultra-small footprint: 25-ball WLCSP (1.71 mm × 1.71 mm) minimizes PCB area for space-constrained designs.
  • Low-power operation: Designed for ultra-low standby power (typical 120 μW), enabling battery-friendly always-on functions.
  • Balanced compute and memory: 2,000 logic elements with ~81.9 kbits of embedded RAM supports a range of control and preprocessing functions without external SRAM.
  • Flexible I/O and drive capability: 18 programmable I/Os with three high-drive outputs (24 mA nominal) enable direct interface to LEDs and other peripherals.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in commercial and industrial handheld environments.

Why Choose ICE40LM2K-SWG25TR?

The ICE40LM2K-SWG25TR positions itself as a space-efficient, low-power FPGA targeted at designers building mobile, sensor-driven and handheld systems. Its combination of 2,000 logic elements, roughly 81.9 kbits of embedded memory, hardened I²C/SPI controllers and on-chip strobe generators enables consolidation of sensor management, interface bridging and always-on logic into a single, tiny package.

With industrial temperature coverage, a narrow supply voltage window for predictable power design, and available Lattice tooling and IP for the iCE40LM family, this device is suited to teams seeking a reliable, compact programmable solution that simplifies BOM and accelerates development.

Request a quote or submit a quote to obtain pricing and availability for ICE40LM2K-SWG25TR.

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