ICE40LM2K-SWG25TR
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 2000 25-XFBGA, WLCSP |
|---|---|
| Quantity | 1,118 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 25-WLCSP (1.7x1.7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 25-XFBGA, WLCSP | Number of I/O | 18 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 2000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM2K-SWG25TR – iCE40 LM FPGA, 2000 logic elements, 25-WLCSP
The ICE40LM2K-SWG25TR is a compact, ultra-low power Field Programmable Gate Array (FPGA) IC from the iCE40 LM family. It delivers 2,000 logic elements with approximately 81.9 kbits of embedded RAM in a 25-ball WLCSP package, optimized for mobile and sensor-management roles where size, power and integration matter.
Designed for applications such as smartphones, tablets and handheld devices, this industrial-grade device integrates hardened I²C and SPI controllers, on-chip strobe generators and flexible I/O, enabling sensor interfacing, pre-processing and always-on logic in a minimal footprint.
Key Features
- Core Logic 2,000 logic elements provide a compact programmable fabric suitable for control, glue logic and sensor preprocessing tasks.
- Embedded Memory Approximately 81.9 kbits of on-chip RAM for storing state, buffers or small data sets close to logic.
- Interfaces Two hardened I²C controllers and two hardened SPI controllers are available for direct sensor and peripheral connectivity.
- Strobe Generators Includes both a Low-Power Strobe Generator (microsecond ranges) and a High-Speed Strobe Generator (nanosecond ranges) for timing-critical sensor and LED control.
- I/O and Drive 18 I/O pins in the 25-pin WLCSP package; three high-drive outputs with nominal 24 mA source/sink capability for direct LED or load driving.
- Clocking Six low-skew global signal resources for flexible, low-skew on-chip clocking and distribution.
- Configuration SRAM configuration via SPI with per-pin controllable pull-ups for flexible boot and interface behavior.
- Power Ultra-low power design with standby power as low as 120 μW typical; supported supply range is 1.14 V to 1.26 V.
- Package & Mounting 25-XFBGA WLCSP (25-WLCSP, 1.71 mm × 1.71 mm) surface-mount package—ideal for constrained board space.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for demanding ambient conditions.
Typical Applications
- Mobile Devices Sensor interface, pre-processing and glue logic in smartphones, tablets and other handheld consumer devices where board space and power are limited.
- Multi-Sensor Management Centralized sensor aggregation, low-latency I²C/SPI bridging and simple sensor fusion tasks for always-on sensor systems.
- Industrial Handhelds Compact programmable logic for handheld commercial and industrial devices requiring industrial temperature operation and reliable I/O control.
- Always-On and Low-Power Systems Low standby power and on-chip strobe generators make the device suitable for always-on sensor monitoring and event-driven wake-up logic.
Unique Advantages
- Highly integrated peripheral set: On-chip dual I²C and SPI controllers reduce external components and simplify sensor connectivity.
- Ultra-small footprint: 25-ball WLCSP (1.71 mm × 1.71 mm) minimizes PCB area for space-constrained designs.
- Low-power operation: Designed for ultra-low standby power (typical 120 μW), enabling battery-friendly always-on functions.
- Balanced compute and memory: 2,000 logic elements with ~81.9 kbits of embedded RAM supports a range of control and preprocessing functions without external SRAM.
- Flexible I/O and drive capability: 18 programmable I/Os with three high-drive outputs (24 mA nominal) enable direct interface to LEDs and other peripherals.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in commercial and industrial handheld environments.
Why Choose ICE40LM2K-SWG25TR?
The ICE40LM2K-SWG25TR positions itself as a space-efficient, low-power FPGA targeted at designers building mobile, sensor-driven and handheld systems. Its combination of 2,000 logic elements, roughly 81.9 kbits of embedded memory, hardened I²C/SPI controllers and on-chip strobe generators enables consolidation of sensor management, interface bridging and always-on logic into a single, tiny package.
With industrial temperature coverage, a narrow supply voltage window for predictable power design, and available Lattice tooling and IP for the iCE40LM family, this device is suited to teams seeking a reliable, compact programmable solution that simplifies BOM and accelerates development.
Request a quote or submit a quote to obtain pricing and availability for ICE40LM2K-SWG25TR.

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