ICE40LM4K-SWG25TR
| Part Description |
iCE40™ LM Field Programmable Gate Array (FPGA) IC 18 81920 3520 25-XFBGA, WLCSP |
|---|---|
| Quantity | 1,047 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 25-WLCSP (1.7x1.7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 25-XFBGA, WLCSP | Number of I/O | 18 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LM4K-SWG25TR – Ultra-low Power 25‑WLCSP FPGA
The ICE40LM4K-SWG25TR is an ultra-low power Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. Built on a 40 nm low-power process, this device provides 3,520 logic elements with integrated memory and hardened peripheral controllers in an ultra-small 25‑ball WLCSP (1.71 mm × 1.71 mm) package. It is optimized for space-constrained, always‑on and mobile sensor-management applications requiring low standby power and flexible I/O.
Key Features
- Core Logic Provides 3,520 logic elements (LUTs) organized across 440 CLBs for compact programmable logic implementations.
- Embedded Memory Approximately 80 kbits of embedded block RAM (81,920 bits) for local buffering, state, and small-data processing.
- Low-Power Operation Designed on an advanced 40 nm ultra-low power process with standby power as low as 120 μW (typical), suitable for always-on sensor tasks.
- Interfaces Two hardened I2C controllers and two hardened SPI controllers are included; programmable I/Os can be used as either these interfaces or general-purpose I/Os. The device provides 18 I/O pins in the 25‑pin WLCSP.
- Strobe Generators Includes two on-chip strobe generators: a Low‑Power Strobe Generator (microsecond range) and a High‑Speed Strobe Generator (nanosecond range) for timing-sensitive sensor and peripheral control.
- High-Drive Outputs Three High Drive outputs are provided with nominal source/sink capability of 24 mA for direct LED drive or other high-current signaling needs.
- Clocking and Routing Six low-skew global signal resources support predictable clock distribution and low-skew routing for timing-critical paths.
- Flexible Configuration SRAM-based configuration is loaded via SPI, enabling flexible in-system programming and updates.
- Package and Mounting 25‑WLCSP (1.7 mm × 1.7 mm) surface-mount package (25‑XFBGA/WLCSP) for ultra-small form-factor designs.
- Industrial Grade Rated for operation from −40 °C to 100 °C and a supply voltage range of 1.14 V to 1.26 V.
- Compliance RoHS compliant.
Typical Applications
- Always-On Sensor Management Act as a low-power sensor manager or pre-processor, handling I2C/SPI sensor interfaces and local event detection while minimizing standby power.
- Mobile and Handheld Devices Implement compact control logic, interface bridges, or user-interface handlers in space-constrained smartphones, tablets, and handheld devices.
- Multi-Sensor Fusion Provide local aggregation, timing, and pre-processing of multiple sensors using embedded RAM and on-chip strobe generators for synchronized sampling.
- LED and Indicator Drivers Drive status LEDs or indicators directly using the device’s high-drive outputs while keeping system-level logic compact and power-efficient.
Unique Advantages
- Ultra-Small Footprint: The 25‑WLCSP (1.71 mm × 1.71 mm) package enables integration into tight board spaces where discrete logic would be difficult to place.
- Low Standby Power: Standby power as low as 120 μW (typical) reduces overall system power for always-on and battery-powered applications.
- Integrated Sensor Interfaces: Hardened I2C and SPI controllers with programmable I/Os reduce external component count and simplify sensor interfacing.
- Deterministic Timing Support: On-chip strobe generators and six low-skew global signal resources help deliver precise timing for sensor sampling and control signals.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to support commercial and industrial applications requiring extended operating temperature.
- Compact Embedded Memory: Approximately 80 kbits of block RAM supports local buffering and small-state machines without external memory.
Why Choose ICE40LM4K-SWG25TR?
The ICE40LM4K-SWG25TR combines a high-density programmable fabric (3,520 logic elements) with embedded RAM, hardened I2C/SPI controllers, strobe generators and high-drive outputs in an ultra-small 25‑WLCSP package. Its low-voltage operation (1.14 V to 1.26 V), ultra-low standby power and industrial temperature rating make it well suited for compact, low-power sensor-manager and always-on roles in portable and industrial designs.
Designed and supported by Lattice Semiconductor Corporation, this device targets developers who need a compact, integrated FPGA solution that reduces BOM, saves board space, and provides flexibility for in-field updates through SPI configuration.
Request a quote or submit a sales inquiry to evaluate ICE40LM4K-SWG25TR for your next low-power, space-constrained design.

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